New Computing
NexCOBOT TT 300-A2Q/A3Q Embedded Box Computers are 12/13th Gen Intel® Core™ i7/i5/i3 high-performance systems with numerous expansion capabilities, including a graphics card for advanced AI and predictive maintenance uses. Two variants offer three (TT 300-A3Q) or two expansion slots (TT 300-A2Q). Onboard M.2 slots are perfect for storage or communication requirements in industrial environments.
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NEXCOM TT 300-A2Q/A3Q Embedded Box Computers12/13th Gen Intel® Core™ i7/i5/i3 high-performance systems with numerous expansion capabilities.9/27/2023
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Laird Connectivity Nitrogen93 SMARCPowered by NXP's i.MX 93 processor, PMIC PCA9450, & Laird Connectivity's Sona™ NX611 radio module.9/19/2023 -
Laird Connectivity Tungsten700 SMARCPowered by MediaTek's Genio 700 processor and the Sona™ MT320 Wi-Fi® 6 / BLUETOOTH® 5.3 radio.9/19/2023 -
Texas Instruments BEAGL-PLAY-SBC BeaglePlay® Single-Board ComputerSimplifies adding sensors, indicators, human interfaces, & connectivity to an embedded system.8/28/2023 -
ADLINK Technology Express-ADP Type 6 ModulePowered by the 12th Gen Intel® Core™ processor with an innovative hybrid architecture.8/23/2023 -
ADLINK Technology Express-ID7 ModuleBased on the Intel® Xeon® D-1700 processor with integrated high-speed Ethernet for up to 4x 10G.8/23/2023 -
Seeed Studio reComputer Industrial Fanless Edge AI DevicesAvailable with pre-installed Jetpack 5.1 SDK, which includes NVIDIA® technologies.8/22/2023 -
Texas Instruments BEAGL-BONE-AI-64 BeagleBone® AI-64 Computing BoardA complete system for developing AI and machine-learning solutions with the BeagleBone platform.8/17/2023 -
Seeed Studio NVIDIA® Jetson Orin™ Developer KitsProvide a platform for the development of edge Artificial Intelligence (AI) and robotics.8/1/2023 -
Seeed Studio Edge AI Devices with Jetson Orin™ ModulesInclude one NVIDIA® Jetson Orin™ production module, a heatsink, and a power adapter.8/1/2023 -
BeagleBoard BeagleV®-Ahead Open-Source RISC-V SBCRISC-V-enabled pocket-size computer in a BeagleBone Black form factor.7/27/2023 -
Ka-Ro Electronics TX93 Computer-on-Module (COM)Features a 1.5GHz Dual ARM® Cortex®-A55 processor based on the NXP i.MX 93.7/20/2023 -
Ka-Ro Electronics QS93 QFN-Style Solder-Down Computer-on-Module100-pin QFN lead-styled module measures 27mm2 x 2.6mm in height and provides a single-sided assembly7/20/2023 -
iWave Systems iW-RainboW-G46M System-On-Modulei.MX 8XLite SoC-based LGA module designed per the Open Standard Module™ (OSM) specification.7/17/2023 -
Laird Connectivity Nitrogen8M Plus SMARCPowered by the i.MX 8M Plus processors from NXP and is compatible with the SMARC 2.1 standard.7/3/2023 -
Seeed Studio NVIDIA® Jetson Orin™ NX ModulesDelivers up to 100 TOPS of AI performance with power configurable between 10W and 25W.6/26/2023 -
Seeed Studio Nvidia® Next-Gen Jetson Orin™ ModulesDelivers power efficiency/computing capabilities needed to build autonomous machines at the edge.6/26/2023 -
Seeed Studio NVIDIA® Jetson AGX Orin™ ModulesProvides up to 275 TOPS and 8X the performance for multiple concurrent AI inference pipelines.6/26/2023 -
Seeed Studio NVIDIA® Jetson Orin™ Nano ModulesDelivers up to 40 TOPS of AI performance in a small form factor with 7W and 15W power options.6/26/2023 -
Laird Connectivity 60 Series SOMsA wireless communications subsystem that may be integrated into various host devices via interfaces.6/16/2023 -
SECO Development Boards for Rapid POCPico-ITX SBCs for computer vision applications and rapid prototypes.6/13/2023 -
Analog Devices Inc. EVAL-CN0575-RPIZ Development Board4-layer printed circuit board (PCB) for evaluating the CN0575.6/6/2023 -
Seeed Studio XIAO Series ProductsA series of dev boards that redefine electronic systems design.5/19/2023 -
Advantech ThinManager® Pocket-Size Edge IoT Thin ClientIntegrates ThinManager software and is verified for ThinManager distributed applications.5/3/2023 -
AAEON UP UP Squared Pro 7000 Developer BoardsOffers greater development potential via high-performance computing power.4/11/2023