Offers the highest Cortex-M memory density of up to 2MB Flash and and 192KB SRAM.
Built on Cree's SC³ Technology™ Platform, w/ industry's smallest lighting-class package at 1W in 2.45 x 2.45mm footprint.
Industry's smallest 0.8 mm by 0.8 mm chipscale package.
Market-leading dynamic resistance of 0.4Ω for 6 channels of USB 3.0 in μDFN-14 package.