Ka-Ro Electronics QSMP Solder-Down Computer On Module
Ka-Ro Electronics QSMP Solder-Down Computer On Module is small at only 27mm2 and a height of 2.3mm. Ka-Ro QSMP Sold-Down module is single-sided assembled and is QFN type lead style with a 1mm pitch and 100 pads. The ground pad additionally acts as a thermal pad.
Features
- Large ground pad on the bottom side makes a defined ground plane connection available for all signals
- The pinout leads to easy wiring without crossing
- Ground will be connected near the signal pin to avoid loop areas
- High-speed signals can be routed on the top layer at a defined impedance
- Ground pad holds the component at a defined height during soldering
Dimensions
Associated Eval Kit
Ka-Ro Electronics QSMP Evaluation Kit
Used to demonstrate the capabilities of the QSMP Series Modules.
Related Module
Ka-Ro Electronics QSMP2 Solder-Down Computer On Modules
Feature up to 60x 3.3V general purpose I/O and LVDS display interface.
Published: 2019-12-11
| Updated: 2025-03-11