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XCKU085-1FLVB1760I

Name: AMD XCKU085-1FLVB1760I
Brand: AMD / Xilinx
SKU: 217-KU085-1FLVB1760I
Price: 6266.25 USD
Availability: OutOfStock

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Mouser #:

217-KU085-1FLVB1760I

Mfr. #:

XCKU085-1FLVB1760I

Mfr.:

AMD / Xilinx

Description:

FPGA - Field Programmable Gate Array XCKU085-1FLVB1760I

Datasheet:

XCKU085-1FLVB1760I Datasheet (PDF)

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Factory Lead-Time:: 28 Weeks Estimated factory production time.

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Qty.	Unit Price	Ext. Price
	$6,266.25	$6,266.25

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	AMD
Product Category:	FPGA - Field Programmable Gate Array
Shipping Restrictions:	This product may require additional documentation to export from the United States.
RoHS:
Series:	XCKU085
Number of Logic Elements:	1088325 LE
Adaptive Logic Modules - ALMs:	62190 ALM
Embedded Memory:	56.9 Mbit
Number of I/Os:	720 I/O
Supply Voltage - Min:	850 mV
Supply Voltage - Max:	850 mV
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 100 C
Data Rate:	16.3 Gb/s
Number of Transceivers:	56 Transceiver
Mounting Style:	SMD/SMT
Package / Case:	FBGA-1760
Brand:	AMD / Xilinx
Distributed RAM:	13.4 Mbit
Embedded Block RAM - EBR:	56.9 Mbit
Moisture Sensitive:	Yes
Number of Logic Array Blocks - LABs:	62190 LAB
Operating Supply Voltage:	850 mV
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	12
Subcategory:	Programmable Logic ICs
Tradename:	Kintex UltraScale

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Datasheet

XCKU085-1FLVB1760I Datasheet (PDF)

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USHTS:: 8542310060
TARIC:: 8542399000
ECCN:: 3A001.a.7.b

Kintex™ UltraScale+™ FPGAs

AMD / Xilinx Kintex™ UltraScale+™ Field Programmable Gate Arrays (FPGAs) feature the highest signal processing bandwidth in mid-range, next-generation transceivers. AMD / Xilinx Kintex UltraScale+ FPGAs are available for packet processing in 100G networking and data center applications. The FPGAs are also ideal for DSP-intensive processing needed in next-generation medical imaging, 8k4k video, and heterogeneous wireless infrastructure. Kintex UltraScale+ FPGAs are optimized for system performance and integration at 20nm and enabled by monolithic and next-generation stacked silicon interconnect (SSI) technology.