Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs

Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs are manufactured from virgin materials to meet or exceed the requirements of building or repairing BGA packages. These solder spheres also exceed MIL standards and IPC for size tolerances and purity levels. The Sn95.5/Ag4.0/Cu0.5 solder spheres are available in nominal sizes from 0.20mm to 0.76mm (8mil to 30mil). These solder spheres are Lead-free and REACH-compliant. The Sn95.5/Ag4.0/Cu0.5 solder spheres are compliant with RoHS 3, REACH, and conflict minerals. These solder spheres operate at 217°C (423°F) melting point and are available in up to 0.60mm sphere diameter.


  • REACH compliant
  • RoHS 3 compliant
  • Conflict minerals compliant
  • Lead-free
  • >24 months shelf life


  • Sn95.5/Ag4.0/Cu0.5 alloy
  • 0.60mm/0.50mm/0.30mm sphere diameters
  • 217°C (423°F) melting point
Published: 2023-08-31 | Updated: 2023-09-14