New Thermal Interface Products
Wakefield-Vette 127-6 Thermal Grease Syringe is a high-performance, non-silicone thermal grease specially formulated without diluent or solvent. This thermal grease offers dispensable and screen printable consistency to achieve low BLT and 6W/m-K thermal conductivity for optimum thermal performance. The 127-6 thermal grease exhibits excellent resistance to pump-out, outgassing, and phase-separation while eliminating the concern of silicone deposition on optics and electronics within any package. Wakefield thermal 10cc non-silicone grease syringe is designed to meet the thermal and reliability requirements of CPU, high-end chipsets, and graphic processors. This 127-6 thermal grease is used in the interface of semiconductors, thermal sensors, IGBTs, LEDs, power transistors, diodes, and power resistors.
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Wakefield-Vette 127-6 Thermal Grease SyringeHigh-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.9/13/2023
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Laird Performance Materials CoolZorb 200 Hybrid TIM/EMI AbsorbersHybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.9/8/2023 -
Laird Performance Materials Tflex™ HD7.5 Thermal Gap FillerSoft silicone material that offers high deflection and 7.5W/mK thermal conductivity.8/3/2022 -
Laird Performance Materials Tpcm™ 7000 High-Performance TIMsDesigned to enhance the cooling of the thermal challenges in electronics.8/3/2022 -
Laird Performance Materials Tpcm™ 5000 High-Performance TIMFeatures low thermal resistance and a non-silicone formulation with a naturally tacky surface.7/19/2022 -
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal GelAssures high thermal conductivity, good dispensing efficiency, and high thermal reliability.7/11/2022 -
Laird Performance Materials Ttape™ 1000A Thermally Conductive TapePressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.6/3/2022 -
Wakefield-Vette Heat Frame Assembly KitsManufactured from solid aluminum and can be designed for compliance with many industry standards.4/28/2022 -
Bergquist Company EV Charging SolutionsDesigned to provide safe charging while protecting EV battery packs from thermal/electrical events.4/13/2022 -
Laird Performance Materials Tflex™ RB300 Thermal Gap FillerExceptionally soft gap filler pads with a thermal conductivity of 1.2 W/mK.3/30/2022 -
Wakefield-Vette ulTIMiflux Gap Pad Evaluation KitFeatures excellent flame retardance and includes 9 varieties of thermal interface materials (TIMs).3/15/2022 -
Bergquist Company TGF 4500CVO 4.5W/m-K High Dispense Rate Gap FillerHigh dispense rate, thermally conductive liquid gap fillers that use 2K silicone technology.11/9/2021 -
Würth Elektronik Thermal Interface KitsIncludes samples of products designed for vertical thermal interfaces and heat spreading interfaces.10/22/2021 -
Bergquist Company TGF 3000SF 3.0W/m-K, Sil-Free Gap FillerTwo-part, silicone-free liquid TIM gap filler that provides thermal conductivity of 3.0W/m-K.10/14/2021 -
Würth Elektronik Thermal Management SolutionsProducts that provide a path for heat energy or spread the heat over a larger dissipation area.8/30/2021 -
Ohmite HS Thermal PadsImproves thermal transfer and lowers operating temperatures between components and heat sinks.7/27/2021 -
Laird Performance Materials GOF3000 Thermal & EMI GasketsOffers electrical conductivity for EMI grounding and a silicone foam core.7/1/2021 -
Laird Performance Materials GOF1000 Thermal Gaskets±0.3mm thickness and width tolerance, 1mm to 9.8mm thickness, and -40°C to +80°C temperature range.7/1/2021 -
Laird Performance Materials GOF2000 Thermal GasketsHigh operating temperature suitability & a high thermal transfer rate suitable for large gap sizes.7/1/2021 -
Laird Performance Materials CoolZorb-Ultra Hybrid Thermal/EMI AbsorbersProvides ultra-high thermal conductivity of 11.5W/m.K to meet the trend of increasing IC power.4/2/2021 -
Laird Performance Materials Tflex™ HP34 Thermal Gap FillerConsists of graphite fibers aligned to provide high bulk thermal conductivity of 34W/mK.4/2/2021 -
Laird Performance Materials Tflex™ SF10 Thermal Gap FillerFeatures 10W/mK thermal conductivity, 0.5mm to 4mm thickness range, and 3.7g/cc density.2/12/2021 -
Ohmite TAP-TP1 Graphite Thermal PadsDesigned for applications requiring reliable performance and high thermal conductivity.1/27/2021 -
Aavid, Thermal Division of Boyd Corporation Sil-Free Plus Non-Silicone Thermal GreaseNon-silicone thermal grease with leading low thermal resistance for thin bond line applications.11/30/2020 -
Laird Performance Materials Tgon™ 805 Series Thermal Interface PadsFeature grain-oriented and plate-like structure that provides a high thermal conductivity.11/4/2020