New Heat Sinks
ADLINK Technology Express-ID7 Module is powered by the Intel® Xeon® D-1700 processor and offers integrated high-speed Ethernet (up to 4x 10G). The ADLINK Technology Express-ID7 also features 16 PCIe Gen4 lanes for immediate responsiveness. The device incorporates Intel® technologies like TCC, Deep Learning Boost (VNNI), and AVX-512 for accelerated AI performance. The Express-ID7 supports Time Sensitive Networking (TSN) for precisely controlling real-time workloads across networked devices. This rugged and edge AI-focused COM, featuring Intel® Ice Lake-D, empowers system integrators for diverse applications, including edge networking, robotics, autonomous driving, 5G, and more.
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ADLINK Technology Express-ID7 ModuleBased on the Intel® Xeon® D-1700 processor with integrated high-speed Ethernet for up to 4x 10G.8/23/2023
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Advanced Thermal Solutions fanSINK™ Designed for Analog Devices Eval BoardsA high-performance 21.0mm x 21.0mm x 13.5mm BGA heat sink with a superGRIP™ attachment.1/11/2023 -
TDK-Lambda ACC-PX2X1 Heatsink KitsFor use with PXD40 / PXD60 DC-DC converters, includes a heatsink, mounting clips, and a thermal pad.8/16/2022 -
CUI Devices BGA Heat SinksIdeal for ball grid array (BGA) devices and measured under four conditions for thermal resistance.12/2/2021 -
Seeed Studio Aluminium Heatsink for the Jetson Xavier NX ModuleOffers effective cooling for prolonged high-performance computing, with active airflow.12/2/2021 -
Advanced Thermal Solutions argus CPU Cooler for ServersDesigned for cooling CPUs, GPUs, and FPGAs in high-performance 2U chassis.10/6/2021 -
Advanced Thermal Solutions cryoQOOL CPU Cooler for ServersFor cooling dense 2U applications using CPUs that fit LGA2011 square, LGA2066, and LGA 1366 sockets.10/6/2021 -
Ohmite C2 Heat SinksConfigurable heat sinks with a slide-in clip for TO-247 and compatible packages.8/24/2021 -
SECO SBC-C90 Single Board Computers3.5” SBCs with AMD Ryzen™ Embedded R1000/V1000 family of System-on-Chips (SOCs).7/26/2021 -
Seeed Studio Aluminum Heatsink for Jetson Nano ModuleOffers effective cooling for prolonged high-performance computing with heat dissipation.7/8/2021 -
Seeed Studio Aluminum Heatsink for Jetson Xavier NX ModuleProvides effective cooling for prolonged high-performance computing.7/8/2021 -
Advanced Thermal Solutions ATS-HK379-R0 High-Performance Cooler Backing PlateConnects CPUs & other processors to Ultra-Cool products, including dual-FLOW™ & quadFLOW™.6/24/2021 -
Ohmite VR Heat SinksIdeally used with high-wattage IXYS devices, TO devices, and the CS10 products.1/4/2021 -
TRACO Power THN 20WIR Series Ruggedized 20W DC/DC ConvertersRuggedized 20W DC/DC converters providing high reliability in harsh environments.12/17/2020 -
Advanced Thermal Solutions PCIe ATS-EXL ExtrusionsOff-the-shelf PCIe extrusion profiles, available in a variety of designs that require no tooling.11/25/2020 -
Carlo Gavazzi RHS Series Heat SinksAvailable with DIN mount, thru-wall, or panel mount designs and up to 4°C/W thermal resistance.11/10/2020 -
Axiomtek CEM130 COM Express Compact ModulesPowered by the onboard AMD Ryzen™ Embedded V1000 processor with AMD Radeon™ RX Vega graphics.10/27/2020 -
Ohmite VX Heat Sinks for TGHE Series & SOT-227 DevicesDesigned for the TGHE series & SOT-227 devices, unique profile offers 3 mounting options.10/27/2020 -
iWave Systems SODIMM Heat Sink67.5mm x 31.5mm package for SODIMM i.MX8M Mini/Nano, Zynq 7000, RZ/G1E, i.MX6 modules.8/3/2020 -
iWave Systems SMARC Heat Sinks82mm x 42mm size, designed for SMARC i.MX8M, i.MX8 QM, and SD820 modules.8/3/2020 -
iWave Systems FPGA Heat Sinks for SOMsDesigned for the FPGA SOMs Arria10 and Zynq Ultrascale+ MPSOC.8/3/2020 -
Axiomtek SMARC ModuleFeatures the NXP dual- or quad-core i.MX8M SoC with up to 4GB LPDDR4 and 64GB eMMC.7/29/2020 -
Ohmite BG HeatsinksRoHS compliant and can be attached to devices with adhesive thermal tape.3/17/2020 -
Kontron COMe-cAL6 COM Express® Compact Type 6 ModuleHighly-scalable Computer-on-Module, covering a broad range of Intel® IoT-ready embedded processors.1/14/2020 -
Aavid, Thermal Division of Boyd Corporation Max Clip™ Heat SinksAnodized and cut-to-length extrusions with pre-installed solder pins.12/18/2019