Terasic Technologies FPGA Cloud Connectivity Kit
Terasic Technologies FPGA Cloud Connectivity Kit integrates the rich versatility of an Intel® Cyclone® V SoC FPGA with cloud connectivity benefits. The FPGA Cloud Connectivity Kit is certified with key cloud service providers (CSPs) such as Microsoft Azure and comes with open-source design examples. These open-source design examples will take new users through the process of connecting an FPGA-based edge device to the cloud for the first time.
The Terasic Technologies FPGA Cloud Connectivity Kit is based on the Terasic DE10-Nano Kit and adds Wi-Fi® and BLUETOOTH® wireless communication. Ambient light, temperature, and humidity sensors are included, along with an accelerometer and gyroscope. The FPGA Cloud Connectivity Kit will permit users to put a flexible and reconfigurable FPGA in a smart IoT edge design.
Features
- DE10-Nano Cyclone V SoC FPGA board
- Wi-Fi, using ESP-WROOM-02 module, up to 100 meter range
- Bluetooth SPP, using HC-05 module, up to 10 meter range
- 9-axis sensor with accelerometer, gyroscope, and magnetometer
- Ambient light sensor
- Humidity and temperature sensor
- UART to USB
- 2x6 TMD GPIO header
Kit Contents
- Quick start guide
- DE10-Nano board
- RFS daughter card
- 40-Pin IDC to box header cable
- Type A to mini-B USB cable x1
- Type A to micro-B USB cable x1
- Power DC adapter (5V)
- microSD card (installed)
- Four silicon footstands
Videos
Related Development Tools
Terasic Technologies DE10-Nano Development Kit
Built around the Intel Cyclone® V System-on-Chip FPGA, offering a robust software design platform.
Board Layout
Kit Contents
Published: 2021-02-01
| Updated: 2023-04-25