Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips
Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips feature a low-profile 5mm stack height, slim 5mm width, and a 0.635mm pitch. These micro interconnects are super dense with up to 240 total inputs/outputs (I/Os). The four-row design allows 10 to 60 positions per row. Samtec AcceleRate HD header and socket connectors are PCIe® Gen 5 compatible, support 56Gbps PAM4 (28Gbps NRZ) applications, and feature an Edge Rate® contact system that is optimized for signal integrity performance. The solder ball technology self-aligns for simplified processing while the open-pin-field design offers grounding and routing flexibility. These mezzanine strips are compatible with Samtec UMPT/UMPS Ultra Micro-Power Connectors for flexible two-piece power/signal solutions.
Features
- Edge Rate® contact system optimized for signal integrity performance
- Compatible with Samtec UMPT/UMPS Ultra Micro-Power Connectors for flexible two-piece power/signal solutions
- Solder ball technology self-aligns for simplified processing
- Open-pin-field design for grounding and routing flexibility
- PCIe Gen 5 compatible
- RoHS compliant
Applications
- High-density board-to-board and backplane interconnects
- 56Gbps 4-level pulse amplitude modulation (PAM4) signaling
Specifications
- 0.635mm pitch
- Stack heights: 5, 7, 9, 10, 11, 12, 14, and 16mm
- Slim 5mm width
- Super dense with up to 240 total I/Os
- 4-row design with 10 to 60 positions per row
- Black LCP insulator material
- Copper alloy contact material
- Au or Sn over 50µ" (1.27µm) Ni plating
Connector Design
Mated View
Videos
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