
IXYS Surface Mount Power Device (SMPD)
IXYS Surface Mount Power Devices (SMPD) provide an innovative solution that allows for many design optimization opportunities across a large number of power electronics applications. Weighing only 8g, the SMPD Package is typically lighter by 50% than comparable conventional power modules, thereby enabling lower weight power systems. Due to their internal insulation by DCB, it is possible to use the same heat sink for multiple devices, reducing thermal management efforts. An added benefit of being smaller and lighter is that it provides higher robustness against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.The SMPD devices can be easily surface-mounted on a Printed Circuit Board (PCB) using a standard pick-and-place and reflow soldering process. No costly screws, cables, bus bars, or selectively soldered contacts are needed.
IXYS offers various devices in SMPD Packages to suit application needs, including:
The IXYS SMPD devices are offered in two package options. The SMPD-B Package, for a wide range of topologies, technologies, and voltage classes, and the SMPD-X Package, for single switches and co-packs for the highest power demands. Both packages share the same compact 23mm x 25mm footprint.
Features
- Ultra-low and compact package profile
- Surface mountable via a standard reflow process
- Low package weight
- Low package inductance
- Excellent thermal performance
- High power cycling capability
- Design allows multiple packages on a common heat sink
Applications
- Battery chargers
- Hard-switching and resonant power supplies
- DC choppers
- DC-DC converters
- Temperature and lighting controls
- Motor drives
- E-bikes, electric and hybrid vehicles
- Solar inverters
- Induction heaters
SMPD Package Outlines

Videos
SMPD Package Types

Published: 2021-06-11
| Updated: 2023-03-09