Espressif Systems ESP32-PICO-V3-02 SiP Module

Espressif Systems ESP32-PICO-V3-02 SiP Module is a System-in-Package (SiP) device based on ESP32 with ECO V3 wafer. It provides complete Wi-Fi and Bluetooth® functionalities. The module integrates an 8MB SPI flash and a 2MB SPIPSRAM. At the core of ESP32-PICO-V3-02 is the ESP32 (ECO V3) chip. This is a single 2.4GHz Wi-Fi and Bluetooth combo chip designed with TSMC's 40nm low-power technology. ESP32-PICO-V3-02 integrates all peripheral components like a crystal oscillator, flash, PSRAM, filter capacitors, and RF matching links. Assembly and testing are already done at SiP level. The ESP32-PICO-V3-02 reduces the complexity of supply chain and improves control efficiency.

Features

MCU
- ESP32 embedded, Xtensa® dual-core 32-bit LX6 microprocessor, up to 240MHz
- 448KB ROM for booting and core functions
- 520KB SRAM for data and instructions
- 16KB SRAM in RTC
Wi-Fi
- 802.11b/g/n
- Bit rate: 802.11n up to 150Mbps
- A-MPDU and A-MSDU aggregation
- 0.4µs guard interval support
- Center frequency range of operating channel: 2412 ~ 2484MHz

Bluetooth®
- Bluetooth V4.2 BR/EDR and Bluetooth LE specification
- Class-1, class-2 and class-3 transmitter
- AFH
- CVSD and SBC
Hardware
- Interfaces: ADC, DAC, touch sensor, SD/SDIO/MMC Host Controller, SPI, SDIO/SPI Slave Controller, EMAC, motor PWM, LED PWM, UART, I²C, I²S, infrared remote controller, GPIO, pulse counter
- 40MHz crystal oscillator
- 8MB SPI flash
- 2MB SPI PSRAM
- Operating voltage/Power supply: 3.0 ~ 3.6V
- Operating temperature range: –40 ~ 85°C
- Dimensions: 7mm × 7mm ×1.11mm