CUI Devices arcTEC Structure High-Performance Peltier Modules

CUI Devices High-Performance Peltier Modules with arcTEC™ Structure feature a unique construction that delivers superior cooling performance and longer cycle life. The innovative arcTEC structure combats the effects of thermal fatigue found in thermoelectric modules. The structure incorporates a thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module, high-temperature solder, and larger P/N elements made from a premium silicon ingot. The combination of these three enhancements greatly improves the reliability, performance, and cycle life of Peltier modules built with the arcTEC structure, allowing them to outperform conventional thermoelectric coolers in the most demanding applications.