CUI Devices arcTEC Structure High-Performance Peltier Modules

CUI Devices High-Performance Peltier Modules with arcTEC™ Structure feature a unique construction that delivers superior cooling performance and longer cycle life. The innovative arcTEC structure combats the effects of thermal fatigue found in thermoelectric modules. The structure incorporates a thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module, high-temperature solder, and larger P/N elements made from a premium silicon ingot. The combination of these three enhancements greatly improves the reliability, performance, and cycle life of Peltier modules built with the arcTEC structure, allowing them to outperform conventional thermoelectric coolers in the most demanding applications. 

Ranging in size from 20mm to 70mm with profiles as low as 3mm, the CUI Peltier modules are available with a ΔTmax of +95°C (Th=+50°C) and current ratings from 2A to 20A. With a reliable solid-state construction, precise temperature control, and quiet operation, the modules are ideal for high-density, high-power medical and industrial applications as well as refrigeration and sealed environments where forced air cooling is not an option. 

Peltier cooling units are also available, featuring a better seal structure for water resistance and absorption of thermal stress.


  • arcTEC structure
  • Wide ΔTmax
  • Precise temperature control
  • Reliable solid-state construction
  • 2A to 20A current rating


  • Industrial
  • Refrigeration and sealed environments where forced air cooling is not an option
  • High-density
  • High-power medical


Published: 2017-10-04 | Updated: 2023-02-28