Bergquist Company TGP EMI1000 Conformable EMI Absorbing GAP PAD® offers both thermal conductivity performance and electromagnetic energy absorption (cavity resonances and/or cross-talk causing electromagnetic interference) at frequencies of 1GHz and higher. The GAP PAD EMI 1.0 provides EMI suppression and 1.0 W/m-K thermal conductivity performance with low assembly stress. The soft nature of the material enhances wet-out at the interface resulting in higher thermal performance than harder materials with a similar performance rating. GAP PAD EMI 1.0 has an inherent, natural tack on one side of the material eliminating the need for thermally-impeding adhesive layers and allowing improved handling during placement and assembly. The other side is tack-free, again enhancing handling and rework, if required. Bergquist Company TGP EMI1000 GAP PAD comes with a protective liner on the material's tacky side.
Thermal Conductivity: 1.0 W/m-K
Electromagnetic Interference (EMI) absorbing
Highly conformable, low hardness
Fiberglass reinforced for puncture, shear and tear resistance