
Amphenol / SV Microwave 3mm Board-to-Board Interconnects
Amphenol SV Microwave 3mm Board-to-Board Interconnects feature 3mm board-to-board spacing with a 0.150" minimum pitch between adjacent connectors. These connectors offer a DC to 40GHz frequency range and provide low stacked heights. The Amphenol SV Microwave 3mm Board-to-Board Interconnects are ideal for use in embedded computing, high-density stacked PCB applications, and high-density multiport applications.Features
- 3mm board-to-board spacing, 0.1134" to 0.1184" range
- 0.150” minimum pitch between adjacent connectors
- DC to 40GHz frequency range
- 50Ω impedance
- 0.30dB to 0.60dB insertion loss range
- Easy-to-assemble, solderless design reduces yield and assembly time
- -65°C to +165°C temperature range
- 1.10:1 or 1.30:1 VSWR
- 500-mating cycle minimum durability
- 0.005" axial misalignment
- 0.007" radial misalignment
- Low-force, solderless installation does not damage PCB
Applications
- Embedded computing
- High-density stacked PCB
- High-density multiport
Videos
Comparison Illustration

Published: 2017-12-01
| Updated: 2022-09-06