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Amphenol / SV Microwave 3mm Board-to-Board Interconnects

Amphenol SV Microwave 3mm Board-to-Board Interconnects feature 3mm board-to-board spacing with a 0.150" minimum pitch between adjacent connectors. These connectors offer a DC to 40GHz frequency range and provide low stacked heights. The Amphenol SV Microwave 3mm Board-to-Board Interconnects are ideal for use in embedded computing, high-density stacked PCB applications, and high-density multiport applications.

Features

  • 3mm board-to-board spacing, 0.1134" to 0.1184" range
  • 0.150” minimum pitch between adjacent connectors
  • DC to 40GHz frequency range
  • 50Ω impedance
  • 0.30dB to 0.60dB insertion loss range
  • Easy-to-assemble, solderless design reduces yield and assembly time
  • -65°C to +165°C temperature range
  • 1.10:1 or 1.30:1 VSWR
  • 500-mating cycle minimum durability
  • 0.005" axial misalignment
  • 0.007" radial misalignment
  • Low-force, solderless installation does not damage PCB

Applications

  • Embedded computing
  • High-density stacked PCB
  • High-density multiport

Videos

Comparison Illustration

Amphenol / SV Microwave 3mm Board-to-Board Interconnects
Published: 2017-12-01 | Updated: 2022-09-06