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TE Connectivity continues to be a key supplier of innovative circuit protection solutions and a leader in PPTC resettable device technology to customers worldwide.

TE's extensive catalog of circuit protection products help prevent overcurrent and overvoltage faults, such as a short, power cross or surge, keeping your devices running longer. TE Connectivity's circuit protection products are a part of everyday life. To date, billions of circuit protection products have been used to help protect a wide range of products in the portable electronics, automotive, industrial appliance and telecommunication markets.

TE Connectivity Newest Products

TE Connectivity Circuit Protection Featured Products

TE Connectivity ChipSESD Protectors

TE Connectivity has expanded its silicon ESD (electrostatic discharge) protection portfolio with the Raychem ChipSESD. Available in the industry's smallest 0201 and 0402 chip scale package (CSP), ChipSESD devices feature bi-directional technology and ultra-low capacitance. Easier to install and rework than traditional semiconductor-packaged ESD devices, the 0201- and 0402-size ChipSESD combines the advantages of active silicon with a traditional SMT passive packaging configuration. TE Connectivity's Raychem ChipSESD Protectors help protect sensitive ICs in small portable electronics such as mobile phones, as well as LCD and plasma displays, HDMI, USB, DisplayPort, and other high-speed digital or low-voltage antenna interfaces.

Tyco Electronics / Raychem PolySwitch femtoSMDC Device

The Tyco Electronics / Raychem PolySwitch femtoSMDC Device's footprint is ultra-small, measuring a mere 1.6mm x 0.8mm x 0.5mm. The miniature size provides circuit protection in space-constrained applications from both overcurrent and overtemperature events. The Tyco Electronics / Raychem PolySwitch femtoSMDC Device is 0603 EIA form factor compliant and can be used in the latest generation of high frequency data ports, I/O ports, and storage devices. The 9V femtoSMDC Device's resettable functionality, fast time-to-trip, and low power dissipation make it a logical and innovative solution for High Density board designs.

TE Connectivity Circuit Protection Resources & Support

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