TE Connectivity ChipSESD Protectors
TE Connectivity has expanded its silicon ESD (electrostatic discharge) protection portfolio with the Raychem ChipSESD. Available in the industry's smallest 0201 and 0402 chip scale package (CSP), ChipSESD devices
feature bi-directional technology and ultra-low capacitance. Easier to
install and rework than traditional semiconductor-packaged ESD devices, the 0201- and 0402-size ChipSESD combines the advantages of active silicon with a traditional SMT passive packaging configuration. TE Connectivity's Raychem ChipSESD Protectors help protect sensitive ICs in
small portable electronics such as mobile phones, as well as LCD and plasma displays, HDMI, USB, DisplayPort, and other high-speed digital or low-voltage antenna interfaces.
Tyco Electronics / Raychem PolySwitch femtoSMDC Device
The Tyco Electronics / Raychem PolySwitch femtoSMDC Device's footprint is ultra-small, measuring a mere 1.6mm x 0.8mm x 0.5mm. The miniature size provides circuit protection in space-constrained applications from both overcurrent and overtemperature events. The Tyco Electronics / Raychem PolySwitch femtoSMDC Device is
0603 EIA form factor compliant and can be used in the latest generation
of high frequency data ports, I/O ports, and storage devices. The 9V femtoSMDC Device's resettable functionality, fast time-to-trip, and low power dissipation make it a logical and innovative solution for High Density board designs.