TE ChipSESD Protectors

TE Connectivity has expanded its silicon ESD (electrostatic discharge) protection portfolio with the Raychem ChipSESD. Available in the industry's smallest 0201 and 0402 chip scale package (CSP), ChipSESD devices feature bi-directional technology and ultra-low capacitance. Easier to install and rework than traditional semiconductor-packaged ESD devices, the 0201- and 0402-size ChipSESD combines the advantages of active silicon with a traditional SMT passive packaging configuration. TE Connectivity's ChipSESD Protectors help protect sensitive ICs in small portable electronics.

Features

EIA-0201 and EIA-0402 size rectangular passive component SMT package
Standard PCB assembly and rework processes
Bi-directional operation allows placement on PCB without orientation constraint
Appropriate for ESD protection in space-constrained portable electronics and mobile handsets
Suitable for +5V operating voltage applications
Helps protect electronic circuits against damage from Electrostatic Discharge (ESD) events
Assist equipment to pass IEC61000-4-2, level 4 testing
RoHS compliant and Halogen Free

Specifications

Low leakage current - 1.0μA (max)
Low working reverse voltage - 6.0V (max)
ESD maximum rating per IEC61000-4-2 standard
± 10kV contact discharge (1)
± 16kV air discharge
Capable of withstanding numerous ESD strikes

Applications

Cellular phones and portable electronics
Digital cameras and camcorders
USB 2.0 and computer I/O ports
Keypads, pushbuttons, low voltage DC lines, speakers, headphones, microphones
Applications requiring high ESD performance

Part Number	Datasheet	Case Size	Height	Input Capacitance	Max. Capacitance	Breakdown Voltage
SESD0201P1BN-0400-090		0201	0.30mm (typ)	4pF	5.0pF	9V Min.	11V Typ.
SESD0402P1BN-0450-090		0402	0.50mm (typ)	4.5pF	5.5pF	9V Min.	11V Typ.