The JAE Electronics FI Series High Speed Cable Assembly Development Kits for LVDS are available in 1-row types for thin devices and 2-row types where high density packaging is required. The LCD connector side has crimped contacts per VESA specifications. The board side connector contacts are crimped onto discrete wire, allowing the customer to populate the connector housing according to their requirements. No expensive crimp tool is required for JAE´s FI series High Speed Cable Assembly Development Kits, allowing low cost LVDS cable development for new designs and prototypes in the growing LCD market.