The Texas Instruments DualCool™ NexFET™ Power MOSFET delivers an industry standard footprint while enabling thermally efficient cooling through the top and bottom of the package. The unique package of the TI DualCool NexFET Power MOSFET allows power system designers to effectively direct heat away from the PCB in high-current DC/DC applications, resulting in improved power density, high-current capability, and improved system reliability. The TI DualCool MOSFET offers 80% higher power dissipation along with 50% more current in standard footprint. DualCool NexFET Power MOSFETs are optimized for control FET applications and Point-of-Load synchronous buck in networking, telecom, and computing systems. Learn More
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