TE Connectivity Reflowable Thermal Protection (RTP)
TE Connectivity Reflowable Thermal Protection (RTP) features low resistance, robust surface mountable thermal protection devices with a set open temperature. The RTP devices are designed to withstand the demanding requirements of the automotive and industrial applications, including shock, vibration, temperature cycling, and humidity exposure. RTP devices can withstand temperatures up to 260⁰C during solder reflow without opening prior to the arming procedure. The newly patented, one-time electronic arming procedure allows the open temperature to be selected so that the device opens in thermal runaway event before reaching the melt temperature of typical lead free solders, but remains closed when the components are operating within the normal parameters. After arming, the RTP opens if its internal junction exceeds the device's specified temperature to protect downstream devices from thermal overload. Constructed to meet stringent automotive and industry qualifications including AEC-Q101, AEC-Q200, and AEC-Q100, the RTP devices are ideally suited for applications such as automotive HVAC, ABS, power steering, DC/DC converters, PTC heaters, IT servers, telecom power, and converters. RoHS compliant and lead & halogen free.
TE Connectivity has expanded their product line of Reflowable Thermal Protection Devices to include Low Temperature RTP Devices.
These devices feature an operating temperature range of 40ºC to +105ºC.
The lower temperature range makes these devices well-suited for the
suitable for consumer, datacom, and appliance markets.
View the TE Connectivity Low Temperature RTP Devices