Molex’s Impact™ Backplane Connector System provides data rates up to and beyond 25 Gbps along with superior signal density of up to 30 pairs per cm (80 differential pairs per inch). The broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system. Impact™ 85 Ohm Plus leverages the 100 Ohm technology, density and footprint that offers an electrically enhanced solution with the addition of a plus clip which improves common mode performance. Impact™ Power is offered in 3- through 6-pair sizes in conventional, coplanar and mezzanine configurations, with current ratings from 60.0 to 120.0A per module. Designed for traditional backplane and/or midplane architectures, the Impact™ Backplane Connector System meets the growing demand for next-generation high-speed applications.