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TE Connectivity Reflowable Thermal Protection (RTP) features low resistance, robust surface mountable thermal protection devices
with a set open temperature. The RTP devices are designed to withstand
the demanding requirements of the automotive and industrial
applications, including shock, vibration, temperature cycling, and
humidity exposure. RTP devices can withstand temperatures up to 260⁰C during solder reflow without
opening prior to the arming procedure. The newly patented, one-time
electronic arming procedure allows the open temperature to be selected so that the
device opens in thermal runaway event before reaching the melt temperature of
typical lead free solders, but
remains closed when the components are operating within the normal
parameters. After arming, the RTP opens if its internal junction exceeds the device's specified temperature to protect downstream devices from thermal overload. NEW!
TE Connectivity has expanded their product line of Reflowable Thermal Protection Devices to include Low Temperature RTP Devices with an operating temperature range of 40ºC to +105ºC.
The lower temperature range makes these devices well-suited for the
suitable for consumer, datacom, and appliance markets.
Features
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Opens at temperature below critical thermal threshold to help prevent failed components from smoking and/or
de-soldering
in case of a
thermal event
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Uses standard surface-mount production methods with no special assembly costs
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Compatible with up to 3 Pb-free
solder reflow
processes with peak temperatures up to 260°C
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Low series resistance,
power dissipation, and
voltage
drop
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Robust design for rugged environment applications (automotive, industrial, etc.)
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Tested per stringent qualification specifications including
AEC-Q101,
AEC-Q200, and
AEC-Q100
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RoHS compliant, lead and halogen free
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Applications
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Automotive
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DC/DC converters
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PTC heaters
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IT servers
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Telecom power
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Converters
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View Product Detail
Additional Resources:
Datasheet Mandarin Datasheet
Product Overview Application Overview
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Specifications
Resistance and Open Characteristics P
1
to P
TH
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Min.
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Typical
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Max.
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Units |
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RPP (Resistance from P
1
to P
TH
)
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@ 23+/-3°C
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-
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0.6
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0.8
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mΩ
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@ 175+/-3°C
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-
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0.8
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1.2
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mΩ
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Operating Voltage
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-
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-
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32
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-
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V
DC
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Open Temperature, post-arming
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I
PP
= 0
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196 |
205
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213
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°C
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Thermal Resistance: Junction to Case
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Case = P
TH
pad
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-
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0.5
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-
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°C/W
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Installation dependent Operating Current, post-arming
(1&2)
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@ 23+/-3°C
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32
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34
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-
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A
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@ 100+/-3°C
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-
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28
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-
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@ 175+/-3°C
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-
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10
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-
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Moisture Sensitivity Level Rating (per JEDEC J-STD-020C)
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-
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-
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1
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-
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-
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(1) Results obtained on 44.5 x 57.2 x 1.6 (in mm) single layer FR4 boards with 70μm (2oz) Cu traces,a 645mm2, 70μm (2oz) Cu heat spreader connected to the P
TH
pad, and a 387mm2 Cu heat spreader connected to the P
1
pad of the RTP device. Results are highly installation dependent.
(2) Operating current is measured on the RTP test boards at the specified temperature. It is a highly installation dependent value.
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