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Home » NEWEST Products » New by Manufacturer » TE Connectivity » zSFP+ Connectors - TE Connectivity
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TE Connectivity zSFP+ I/O Interconnects

TE Connectivity zSFP+ I/O Interconnects

TE Connectivity zSFP+ pluggable I/O interconnects were designed to quickly and easily upgrade SFP/SFP+ connectors from current 10-16 Gbps speeds to future 28 Gbps speeds. The design is backward-compatible to SFP/SFP+ products, the interconnect is hot-swappable with existing SFP+ connectors for fast system upgrades of 28-40 Gbps. Alternatively, users can design-in the zSFP+ connector for 10-16 Gbps data rates, establishing a progressive path to higher speeds-an upgradeability that can result in longterm cost savings as this would eliminate the need to fully redesign for higher performance. The zSFP+ interconnect is compliant to SFF-8402 and has been adopted for Fibre Channel 32G (28.05 Gbps line rate).

Also available TE Connectivity SFP+ I/O Interconnects

  • 28 Gbps up to potentially 40 Gbps, 10 Gbps Ethernet and 16 Gbps Fibre Channel
  • Surface-mount connector design
  • Press-fit cages for one-step, easy PCB placement
  • Coupled, narrow-edged, blanked- and formed-contact geometry and insert molding for superior signal integrity, mechanical and electrical performance
  • Backwards- compatibility: shares same PCB footprint, mating interface and cage dimensions with the SFP+ connector
  • EMI containment offered in either elastomeric gasket or spring finger options
  • Single-port high cages (1xN) for design flexibility / accommodates belly-to-belly applications to increase density while saving PCB space
  • Offers stacked cages in 2x1, 2x2, 2x4, 2x6, 2x8, 2x10 and 2x12 port configurations
  • Heat sinks, LEDs and plating choices offered for various design specifications
  • Mating Force: 25N
  • Unmating Force: 11.5N
  • Durability (min.): 250 cycles
  • Voltage (max.): 120V
  • Current (max.): 0.5A
  • Dielectric Withstanding Voltage: 300V AC between contacts
  • High-temperature thermoplastic housing (glass filled, UL 94V-0 black)
  • High-performance copper alloy contacts
  • Nickel underplating; Tin plating on solder tail area; Gold plating on mating area
  • Operating temperature: -40°C to 85ºC
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  • TE Connectivity - Connectors