TE Raychem ChipSESD Protectors
TE Connectivity has expanded its silicon ESD (electrostatic discharge) protection portfolio with the Raychem ChipSESD. Available in the industry's smallest 0201 and 0402 chip scale package (CSP), ChipSESD devices
feature bi-directional technology and ultra-low capacitance. Easier to
install and rework than traditional semiconductor-packaged ESD devices, the 0201- and 0402-size ChipSESD combines the advantages of active silicon with a traditional SMT passive packaging configuration. TE Connectivity's ChipSESD Protectors help protect sensitive ICs in small portable electronics.
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Features
- EIA-0201 and EIA-0402 size rectangular passive component SMT package
- Standard PCB assembly and rework processes
- Bi-directional operation allows placement on PCB without orientation constraint
- Appropriate for ESD protection in space-constrained portable electronics and mobile handsets
- Suitable for +5V operating voltage applications
- Helps protect electronic circuits against damage from Electrostatic Discharge (ESD) events
- Assist equipment to pass IEC61000-4-2, level 4 testing
- RoHS compliant and Halogen Free
Specifications
- Low leakage current - 1.0μA (max)
- Low working reverse voltage - 6.0V (max)
- ESD maximum rating per IEC61000-4-2 standard
- ± 10kV contact discharge (1)
- ± 16kV air discharge
- Capable of withstanding numerous ESD strikes
Applications
- Cellular phones and portable electronics
- Digital cameras and camcorders
- USB 2.0 and computer I/O ports
- Keypads, pushbuttons, low voltage DC lines, speakers, headphones, microphones
- Applications requiring high ESD performance
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