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Home » NEWEST Products » New by Manufacturer » Omron Electronics LLC » XF3M FPC/FFC Connectors - Omron
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Omron Electronics XF3M Series 0.5 or 1.0mm pitch FPC/FFC Connectors

Omron Electronics XF3M Series 0.5mm or 1.0mm Pitch
FPC/FFC Connectors

Omron Electronics has expanded the XF3M Connector series to include additional pin counts. Omron Electronics XF3M Series 0.5mm or 1.0mm Pitch FPC/FFC Connectors provide improved insertion of FPC/FFC cables and help confirm proper connection with a sure-lock feel. The XF3M series features a rotary back lock mechanism, high retention force with a dual contact structure, applicable FPC/FFC thickness of 0.30±0.05mm, and a Ni-barrier for high resistance to solder creep(gold plated). With the XF3M Series, the FPC/FFC can be inserted from a slanting top direction and there is a positive click feeling for locking.

Features
  • Models available with 0.5mm or 1.0mm pitch
  • Dual contact design reduces the number of parts in the Bill of Materials
  • Applicable FPC/FFC thickness of 0.3mm
  • Rotary back lock mechanism
  • Ni-barrier for high resistance to solder creep (gold plated)
  • Halogen Free: OMRON uses the following standard to determine halogen free construction: 900 ppm max. for Br, 900 ppm max. for Cl, and 1,500 ppm max. for Br+Cl
  • RoHS Compliant
Characteristics:
  • Rated current 0.5A AC/DC
  • Rated voltage 50V AC/DC
  • Contact resistance 50 mΩ max. (at 20 mVDC max., 100 mA max.)
  • Insulation resistance 100 MΩ min. (at 250 VDC)
  • Withstand voltage 250 VAC for 1 min. (leakage current: 1 mA max.)
  • Insertion tolerance 20 times
  • Ambient operating temperature -30 to +85°C (with no icing or condensation)
Materials and Finish:
  • Housing LCP resin (UL94V-0)/natural
  • Slider LCP resin (UL94V-0)/black
  • Contacts Spring copper alloy/nickel substrate (1.5 μm), Gold-plated contacts (flash)
  • Hold-down Copper alloy/fused-tin plating (1 μm)
0.5mm Dimensions
0.5mm Dimensions
1.0 Dimensions
1.0 Dimensions
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