|    Change Country Change Location USD
 
United States United States

Please confirm your currency selection:

US Dollars
Home » NEWEST Products » New by Manufacturer » Ohmite » Ohmite Heatsinks
NEWEST Products
Ohmite Heatsinks

Ohmite Heatsinks

Ohmite Heatsinks have been designed to take advantage of thermal transfer, reliability, and design flexibility. Ohmite's heatsink product line utilizes a patented Matrix Clip system that provides constant spring force over repeated assembly and disassembly. The elimination of mounting hardware reduces costs and enables a maximum surface area per unit design. Ohmite heatsinks are designed to secure TO-126, TO-218, TO-220, TO-247, and TO-264 packages, plus provide thermal solutions for TO-252, TO-263, and TO-268 SMD devices.

B60/C60 Series Heat Sinks

Ohmite C60 Series Heat Sink System offers an improved Cam N Lock spring clip (pat. pending) in addition to flexible, high performance in a compact heat sink with exchangeable cam clip system for TO-220, TO-247, and TO-264 devices. The C Series' built-in lip provides mounting ease.  The B60 Series Heat Sinks from Ohmite can be thru-hole soldered as a single or dual unit that can be mated to a 60mm fan for greater thermal performance. B60 series heat sinks are ideal for electronic packaging that exhibits high power density, small size (3U or 4U), and forced convection.

More About B60/C60

B60 Series Features
  • Can be thru-hole soldered as a single or dual unit
  • Dual unit can be mated to a 60mm fan for greater thermal performance
  • Ideal for high power density and small size (3U or 4U) electronic packaging with forced convection
C60 Series Features
  • Improved Cam N Lock spring clip (Pat. Pending)
  • Flexibility, high performance
  • Has exchangeable cam clip system for TO-220, TO-247, and TO-264 devices
  • Built-in lip for mounting ease

C Series Heatsinks

Ohmite C Series Heatsinks offer high performance, low cost and compact heat sinks with an integrated camming clip system.This powerful heat sink provides tool and fixture free assembly operation, largest surface areas and smallest space occupation. The Ohmite C Series Heatsinks are the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, such as semiconductors and resistors.  The C series is available in TO-126, TO-220, and TO-264 versions.

More About C Series

Features
  • Minimum assembly cost and labor spring clips
  • Maximum repeatability constant spring force over repeated assembly/disassembly
  • Maximum thermal transfer
  • Maximum reliability resilient spring action that locks electronic component in place
  • Design flexibility
  • Integrated camming clip system for TO-126, TO-220, TO-247, and TO-264 devices

C40 Heat Sink System

Ohmite C40 Series Heat Sink System offers flexible, high performance, and compact heat sinks with an exchangeable cam clip system for TO-247, TO-264, and SOT-227 (clip in development) devices. This powerful heat sink can be thru-hole soldered in single or paired configurations. The paired unit has mounting holes to accommodate a 40mm x 40mm fan. Ideal applications for Ohmite C40 Series Heat Sink System include high power density and small size (1U or 2U) electronic packaging with forced convection.

View Ohmite C40 Heatsinks

Features
  • Mounting holes
  • Flexible, high performance, and compact
  • Exchangeable cam clip system
Applications
  • High power density
  • Forced convection
 
Part Number Length Width Mounting Style




First Previous Next Last

CP4 Series Heat Sinks

Ohmite CP4 Series Heat Sinks are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor devices. Ohmite CP4 Series Heat Sinks are customizable to fit multiple applications. Length and mounting hole patterns can be specified.

More About Ohmite CP4 Heatsinks

Features
  • Designed for Ohmite products, Pre-drilled hole patterns for standard Ohmite planar resistors TAP600/TAP800 and TAP1K0/TAP2K0
  • Design flexibility, chill plate lengths can be configured as well as mounting hole patterns to accept a multitude of devices
  • Thermal efficient design, exposed copper tubing on the mounting surface for the most efficient heat transfer

D Series Heatsinks

Ohmite D Series Heatsinks have been expanded with two new extrusion forms. The new extrusions do not require the use of Kapton Tape to facilitate pick-and-place equipment. Ohmite D Series Heatsinks for SMT compatible semiconductors and resistors combine tin plated, solderable rods with an aluminum extruded heatsink body. These rod (rollers) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. With increased thermal performance up to 30% over bright copper heat sinks, the Ohmite D Series Heatsinks are designed for use with the popular TO-263 and TO-268 packages and the light weight aluminum construction allows faster pick and place assembly.

More About D Series Heatsinks

Features
  • Thermal performance up to 300% over the aluminum stamped heatsinks on the market
  • Light weight aluminum construction for faster pick and place assembly
  • Radius mounted "Rollers" designed for maximizing heat transfer
  • Available in bulk packaging or tape & reel (250 units per reel)
  • RoHS compliant

E Series Heatsinks

Ohmite E Series Heatsinks for TO-220 Devices feature vertical through-hole PCB mounting (3 holes are 0.142" diameter each). In heights of 1.5", 2.0", and 2.5", the Ohmite E Series Heatsinks are aluminum 6063-T5 or equivalent with either black anodized or degreased finish, The solder feet are tin plated brass.

More About E Series Heatsinks

Features
  • Vertical through-hole PCB mounting
  • 0.142 in. diameter mounting holes (3)

F and R Series Heatsinks

Ohmite F and R Heatsinks for TO-218, TO-220, and TO-247 Devices are designed for vertical mounting with solderable pins. The F and R series heatsinks from Ohmite have black anodized finish, 6063-T5 aluminum material, 100% tin solder, and 0.091" diameter pre-tinned pins for PCB board attachment.

More About F and R Heatsinks

Features
  • For vertical mounting with solderable pins
  • For TO-220, TO-218, and TO-247
Specifications
  • Finish: Black anodized
  • Material: 6063-T5 aluminum
  • Solder: 100% Tin (Sn)
  • PC board attachment: 0.091" dia. pre-tinned pins

M Series Heatsinks

Ohmite M Series Dual Clip Heatsinks have been expanded.  New sizes are available! The Ohmite M Series Dual Clip Heatsinks for TO-264 and TO-247 packages are patented, high performance, low cost, configurable, scalable, and compact heatsinks with a matrix clip system. This powerful heatsink provides the easiest assembly, largest surface area, and smallest footprint. The Ohmite M Series Dual Clip Heatsinks for TO-264 and To-247 are the ideal type of heatsink for high power density and small size (1U or 2U) electronic packaging with force convection cooling.

More About M Series Heatsinks

Features
  • Minimum assembly cost and labor
  • Maximum thermal transfer
  • Maximum repeatability
  • Maximum reliability
  • Design flexibility

R2 Series Heatsinks

Ohmite R2 Series Heatsinks have been expanded. New sizes available! Ohmite R2 Series Heatsinks feature reduced assembly cost due to camming clips, maximum repeatability, and maximum reliability. Ohmite R2 Series Heatsinks' maximum surface area per unit volume and consistent mounting force reduces thermal resistance. Light weight, resilient clips lock R2 Series Heatsinks in place, making them highly resistant to shock and vibration. The C Series clipping mechanism provides a large surface area for the Ohmite R2 Series Heatsinks to attach either a TO-220 or TO-247 package.

View Ohmite R2 Heatsinks

Features
  • Reduced assembly cost
  • Maximum repeatability
  • Maximum heat transfer per unit space
  • Maximum resistance to shock and vibration
  • Maximum reliability
  • RoHS compliant

S Series Heatsinks

Ohmite S Series LED Heatsinks are low cost and easy assembly heat sinks for "Star" LED packages supplied by Osram and others. This simple heat sink can hold LED modules and can be mounted simply with some thread forming screws. The Ohmite S Series LED Heatsinks have two types of surface finish and can be used in either natural (free) or forced convection cooling applications.

More About S Series Heatsinks

Features
  • Low cost and easy assembly
  • Can hold LED modules
  • Simple mounting with thread forming screws
  • Two types of surface finish
  • Can be used in natural (free) or forced convection cooling applications

VM Variable Mount Heat Sinks

Ohmite VM Variable Mount Heat Sinks feature a versatile design that can accommodate several different industry packages. Ohmite VM Heat Sink design also lets the user choose a mounting style using screws or clips for secure mounting to the heat sink. VM heat sinks are offered in a vertical (free convection cooling) or horizontal format (forced convection cooling) to fit a variety of applications.

More About VM Series


Specifications
  • Mount
    • Vertical (VM1-038-1AE)
    • Horizontal (VM2-038-1AE)
    • Universal (VM3-038-1AE)
  • Anodized surface finish
  • 38.6mm Length (L) or Height (H)
  • 39.6in2 / 25,546mm2 Surface Area
  • Cold-rolled Steel Solder Foot, Per ASTM A-366 with Pure Tin over Copper Strike
    • RoHS compliant
    • Barbed for secure attachment

Dimensions

Dimensions

W Series Heatsinks

Ohmite W Series Heatsinks for Power Resistors have been expanded. New sizes are available. Ohmite W Series heatsinks are for TO-220 and TO-247 Power Resistor or similarly packaged semiconductors. These self-aligning Ohmite W series heatsinks feature solderable feet for through-hole placement, and an integrated clip which provides 1.32 (lbf) of force on the center of the resistor, enhancing thermal performance and reducing parts count and assembly time.

More About W Series Heatsinks

Features
  • Reduced assembly cost
  • Maximum repeatability
  • Maximum heat transfer per unit space
  • Maximum resistance to shock and vibration
  • Maximum reliability
  • RoHS compliant
eNews
  • Ohmite
  • Passive Components|Thermal Management