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Home » NEWEST Products » New by Manufacturer » Murata Wireless Solutions » Murata SyChip High-Power ZigBee Module & Evaluation Kit
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Murata Wireless Solutions SyChip
High-Power ZigBee® Module & Evaluation Kit

Murata Wireless Solutions SyChip High-Power ZigBee® Module (SN3020) is the industry's smallest--just 400mm²--fully integrated ZigBee® module with +20dBm output power and 1MB of serial flash memory for a wide range of applications. It offers the best-in-class ZigBee® RF performance with 124dB link budget for long range, and includes a 32-bit ARM Cortex M3 processor for customer applications. The Murata SyChip High-Power ZigBee® Module Evaluation Kit includes two evaluation/development boards with SN3020 modules to interface to the host, two USB cables, an RF cable, and a CD with software and manuals. The SyChip ZigBee® modules are designed to be easily integrated into designs without the need for RF or embedded software expertise. Using a SyChip module allows designers to add the latest meshing radio technology without complex software engineering.


Module Features
  • Complete ZigBee PRO compliant profiles
    • Smart energy
    • Home automation
  • Low power operation
    • Sleep - 1.2μA
    • Transmit - 165mA@20dBm
    • Receive - 31mA
  • Customized application software
    • Allows customers to use the ARM Cortex M3 processor for their own applications
    • Minimizes design and development effort with custom API libraries
  • Best-in-class radio receive sensitivity
    at -103dBm
  • FCC certified
Module Specifications
  • Dimensions: 27.20 x 14.75 x 2.90mm3
  • Ember EM357 high-performance, integrated ZigBee/802.15.4 chipset
  • Supply voltage: 2.4V to 3.4V
  • Data logging memory: 8Mb serial flash
  • Security: 128-bit AES
  • Antenna: on-module
  • Host interface: SPI, UART
  • Meter interface: I2C, GPIO
  • ADC ports: 6 x 14-bit
  • Integrated PA/LNA
  • Integrated 2.4GHz chip antenna (optional external antenna)
  • Maximum output power: +20dBm
  • Operating temperature: -40º to +85ºC
  • RoHS compliant
  • MSL JEDEC level 3
Block Diagram

Block Diagram

Evaluation Kit Contents

Evaluation Kit Contents

Module Outer Dimensions in mm

Module Outer Dimensions

Module Inner Dimensions in mm

Module Inner Dimensions

  • Murata Wireless Solutions
  • Wireless
  • Development Tools|Embedded Solutions