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Home » NEWEST Products » New by Manufacturer » Molex » Molex zSFP+ SMT Connectors
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Molex zSFP+ SMT Connectors

Molex offers the zSFP+ SMT Connectors to support 25 Gbps data rates and deliver unparalleled signal integrity with excellent EMI protection for next-generation Ethernet and Fibre Channel applications. Superior signal integrity (SI), mechanical, and electrical performance are assured through a patent-pending preferential coupling design that uses a narrow-edge, coupled, blanked- and formed-contact geometry and insert molding. Constructed with a high-temperature thermoplastic housing, these connectors withstand lead-free processing in an operating temperature range of -40°C to +85°C. Fully backward compatible, the zSFP+ SMT Connectors use the same PCB footprint, mating interface, and EMI cage dimensions as SFP+ form factor connectors, enabling them to be used as a drop-in replacement for current SFP+ designs.

  • New: Improved airflow
  • Patent-pending preferential coupling design uses a narrow-edge, coupled, blanked- and formed-contact geometry and insert molding for superior signal integrity (SI), mechanical and electrical performance
  • Capable of handling 25 Gbps data rates to support current 10 Gbps Ethernet and 16 Gbps Fibre Channel applications with additional margin without changing the host board design (for the SMT version)
  • Backward compatible with SFP+ form factor connectors to ensure the same PCB footprint, mating interface and EMI cage dimensions
  • Utilizes industry-standard footprint which can be used as a drop-in replacement for current SFP+ designs
  • High-temperature thermoplastic housing withstands lead-free processing
  • Second sourced by TE Connectivity provides a fully tested, intermateable solution with performance compatibility
  • Telecommunication and Data Communication equipment
    • Switches, routers, hubs
    • Central office, cellular infrastructure and multi-platform service systems
      (DSL, Cable Data)
    • Storage

Electrical Specifications
  • Voltage (max.): 30V AC (RMS)/DC
  • Current (max.): 0.5A

Mechanical Specifications
  • Mating Force: 25N
  • Durability (min.): 250 cycles

Physical Specifications
  • Housing: High-Temperature Thermoplastic Glass Filled, UL 94V-0 Black
  • Contact: Copper Alloy
  • Plating:
    • Contact Area — 15 and 30μ" Gold
    • Solder Tail Area — Tin
    • Underplating — Nickel
  • Operating Temperature: -40 to +85°C

Part Number Description Contact Plating

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