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Home » NEWEST Products » New by Manufacturer » Molex » Molex VHDM® H-Series Backplane Connector System | Mouser
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VHDM® H-Series
Backplane Connector System

Molex designed the Very High Density Metric ‘H’ Series (VHDM® H-Series) Backplane Connector System for applications with very high interconnect density and high-speed signal integrity requirements. The VHDM H-Series Backplane Connector System achieves data rates up to 6.25 Gbps on an installed base and enables system upgrades without costly architecture redesigns. With a mating interface and envelope identical to earlier series, the VHDM H-Series is fully backwards compatible with existing VHDM slots. Using the Molex VHDM H-Series Backplane Connector System, designers can prolong the life of existing platforms, minimize development costs, and accelerate the speed higher-performance applications to market.

The signal portion of the Molex VHDM H-Series Backplane Connector System features modular construction with 10 columns or 25 columns in either 6 rows or 8 rows. The metal stiffener in the daughter card connector can join signal wafers, power modules, and guidance modules to make one continuous connector with a maximum length of 300mm. The mating guide features on the metal pins and key slots provide excellent guidance for large PCBs and eliminate the possibility of insertion of a daughter card into the wrong slot.

Molex VHDM H Series Backplane Connector System
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Additional Resources:

Datasheet

Network Solutions Cube 2.0

Molex eLearning: Select anywhere on the Cube to view the range of interconnect solutions for boards, modules, and cables.

Backplane Technology
Molex eLearning: Backplane features, signal basics, selecting the right product, etc.

Features and Benefits

  • Data rates up to 6.25 Gbps, the highest of all VHDM® versions enable system upgrade scalability without costly architecture
  • Mates with existing VHDM® systems to enable backwards compatibility with existing VHDM® slots, extends the life of existing platforms, reduces development costs and provides a high system speed to the market
  • Ability to combine VHDM® L-Series
    (1 Gbps), VHDM® (3.125 Gbps), VHDM® H-Series (6.25 Gbps) and VHDM-HSD™ (5Gbps) wafers on the same metal stiffener reduces application costs while improving design flexibility
  • Internal ground shields control impedance and minimize cross talk
  • Small compliant-pin 0.45mm (.018”) PCB hole size improves PCB routing and back drilling while reducing impedance discontinuities
  • Modular construction maximizes design flexibility via custom configuration of signal, power and guide modules


Electrical
Specifications
  • Signal Contact: 1.0A
  • Shield Contact (6 Row): 2.0A
  • Shield Contact (8 Row): 3.0A
  • Per Power Blade: 10.0A
  • Delivers up to 120.0A per 25mm (.984") of board edge
  • Multiple mating levels for hot plug applications

Physical
Specifications
  • Housing: Liquid Crystal Polymer, UL 94V-0m
  • Contact: Copper (Cu) Alloy
  • Plating:
    • Contact Area – 0.76μm (30μ”) Gold
      (Au) min.
    • Solder Tail Area – Tin (Sn) or Tin/Lead
      (Sn/Pb)
    • Underplating – Nickel (Ni)
  • PCB Thickness: 1.60mm (.063”) typical
  • Operating Temperature: -55 to +85°C


Mechanical Specifications
  • Mating Force:
    • Signal: 40g per signal pin
    • Shield: 25g per shield chevron
    • Power: 150g per blade
    • Durability: 200 cycles
  • Normal Force:
    • Signal: 50g min.
    • Power: 100g min.

Markets and Applications
  • Telecommunication equipment
  • Hubs, switches, routers
  • Central office, cellular infrastructure and multi-platform (DSL, Cable Data) systems
  • Medical imaging
  • Data networking equipment
  • Storage
  • Servers
  • Test and measurement equipment
  • Military














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