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Home » NEWEST Products » New by Manufacturer » Molex » Molex 2.4 GHz SMD On-Ground Antenna
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Molex 2.4 GHz SMD On-Ground Antenna

Molex 2.4 GHz SMD On-Ground Antenna as the smallest on-ground MID (Molded Interconnect Device) antenna in the market using the power and precision of Laser Direct Structuring (LDS) technology. Measuring only 3.00mm by 3.00mm by 4.00mm (0.118" by 0.118" by 0.157") and mated on one side of the PCB , the Molex 2.4 GHz SMD On-Ground Antenna enables designers to realize significant PCB real estate savings by leaving the ground layers in the PCB intact while freeing up space on the reverse side for other component assemblies. Featuring an omni-directional radiation pattern, this monopole antenna requires simple stripline matching on the PCB without the need for discrete components. Fully compatible with SMD and reflow processes, the Molex 2.4 GHz SMD On-Ground Antenna can be used as a stand-alone device without the need for cable connection. In addition to offering excellent thermal properties, the LCP body of the antenna provides a higher mechanical strain tolerance than ceramic antennas. Weighing 0.03g, the 2.4 GHz SMD On-Ground Antenna is ideally suited for portable electronic devices based on Bluetooth ®, Wi-Fi ® ZIGBEE ® and other wireless standards.

  • Valuable PCB real estate savings on both sides of the PCB with the use of this miniature antenna
  • No removal of ground layers from beneath the antenna is needed
  • Consistent antenna RF performance with the application of Laser Direct Structuring (LDS) - a technology known for its excellent precision, performance and repeatability
  • High-temperature base material and the metal plating technology enables the antenna to endure reflow temperatures - an ideal condition for a standard SMT process
  • Halogen-free and RoHS-compliant

Electrical Specifications
  • RF Power (Watt): 2
  • Frequency (MHz): 2400 to 2483.5
  • Return Loss - S11 (dB): < -9
  • Average Total Efficiency (%): > 70
  • Peak Gain (dBi): 3.0
  • Polarization: Linear
  • Input Impedance (Ohms): 50

Mechanical Specifications
  • Peeling Force: 1N (0.225 lb force)

Physical Specifications
  • Dimension: 3.00mm by 3.00mm by 4.00 mm (0.118" by 0.118" by 0.157")
  • Housing: LCP-LDS, Vectra E840ILDS, 40% mineral-filled LDS grade
  • Flammability: UL 94V-0
  • Plating:
    • Hatched Area — 0.1μm (4μ") Gold (Au) min.
    • MID Plane — 2.0μm (8μ") Nickel (Ni) min.
    • Underplating — 12μm (472μ") Copper min.
  • Operating Temperature: -35 to +85°C
  • Storage Temperature: -40 to +85°C

Telecommunication Applications

    • Bluetooth devices
    • Headsets
    • Notebooks and netbooks
    • Smart Phones
    • Tablet PCs
    • WiFi devices
    • Wireless LAN (WLAN)
    • IEEE 802.11b/g/n devices

    Industrial Applications
    • Machine-to-machine (M2M) communications
    • Smart meters
    • Lighting controls
    • ZigBee IEEE 802.15.4 devices
    • 2.4 GHz Industrial, Scientific and Medical (ISM) band systems and wireless devices

    Consumer Electronics (CE) Applications
    • Cameras
    • Mobile gaming devices
    • Personal navigation devices
    • Wireless internet TV and Audio

    Automotive Applications
    • Bluetooth devices
    • Infotainment systems

    Medical Applications
    • Telemedicine and Telehealth devices

  • Molex
  • Passive Components|Antennas