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The Molex Micro SAS Receptacles are the storage industry's most compact, next-generation high-speed I/O solution for 1.8 inch drives in mission-critical enterprise-storage Serial Attached SCSI (SAS) applications. The high-speed Micro SAS Receptacles achieve data rates up to 6 Gbps, are fully backward compatible, and comply with SAS 2.0 specifications. Molex’s Micro SAS connectors are an ideal solution for high-speed, high-bandwidth SAS applications including solid state drives (SSD), RAID server storage, and HBA adapters. Available versions include the Micro SAS Receptacle, Right Angle, SMT and Right Angle, Dual Stacked.
| Part Number | Description | Number of Positions / Contacts | Termination Style |
| 78495-0001 | Micro SAS Receptacle, Right Angle, Dual Stacked | 50 | Through Hole |
| 78395-0001 | Micro SAS Receptacle, Right Angle, SMT | 25 | SMD/SMT |
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Additional Resources:
Datasheet
Power, Signal, I/O
Molex eLearning: Overview of technology and Molex's three categories of connectors.
Network Solutions Cube 2.0
Molex eLearning: Select anywhere on the Cube to view the range of interconnect solutions for boards, modules, and cables.
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Features and Benefits
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Small connector footprint
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Satisfies SAS 2.0 specifications
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Intermateable with Micro Serial ATA parts
with mid-rib in the connector housing
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Application of Micro SAS Plug in 1.8"
form
factor drives (SSD or HDD)
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Host receptacle on backplane accommodates Molex Micro SAS or Micro SATA drives
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Drive can be built with any Molex Micro SAS or Micro SATA Plugs, and programmable with SAS or SATA firmware
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Crush-ribs on plugs & dual-shaped pegs on receptacles provide added PCB retention to straddle-mounted plugs and seating of vertical receptacle on PCB, respectively
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Keying features and guide rails on connectors prevent mis-mating and ensure smooth entry of plugs to receptacles
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Electrical
Specifications
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Voltage (max.): 30V
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Current (max.): 1.5 Amps DC or AC (RMS) at 60 Hz
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Low Level Contact Resistance (min.): 45 milliohms (initial)
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Dielectric Withstanding Voltage: 500V AC
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Insulation Resistance (min.): 1000 Megaohms
Physical
Specifications
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Housing: LCP, Glass-filled,UL 94V-0, Black
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Contact: Copper Alloy
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Plating:
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Contact Area – 0.76μm (30μ") Gold (Au)
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Solder Tail Area — 2.54μm (100μ") Tin (Sn) (78394)
1.91μm (75μ") Tin (Sn) (78528)
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Underplating — 1.27μm (50μ") Nickel
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PCB Thickness: 1.00mm (.039")
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Operating Temperature: 0 to +55°C
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Mechanical
Specifications
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Connector Insertion Force (max.): 20 N (to Backplane Receptacles)
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Connector Removal Force (min.): 2.5N (to Backplane Receptacles)
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Terminal Retention Force (min.): 4.45N
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Durability (min.): 500 cycles (Backplane/Blindmate)
Markets and Applications
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Storage Drives
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Solid State Drives (SSD)
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1.8” HDD
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Server Storage
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RAID (Redundant Array of Individual Disks)
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JBOD (“Just a bunch of disks”)
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Adapters
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