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Home » NEWEST Products » New by Manufacturer » Molex » Molex Micro SAS Receptacles
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Molex Logo Micro SAS Receptacles
For mission-critical enterprise-storage
Serial Attached SCSI (SAS) applications


The Molex Micro SAS Receptacles are the storage industry's most compact, next-generation high-speed I/O solution for 1.8 inch drives in mission-critical enterprise-storage Serial Attached SCSI (SAS) applications. The high-speed Micro SAS Receptacles achieve data rates up to 6 Gbps, are fully backward compatible, and comply with SAS 2.0 specifications. Molex’s Micro SAS connectors are an ideal solution for high-speed, high-bandwidth SAS applications including solid state drives (SSD), RAID server storage, and HBA adapters. Available versions include the Micro SAS Receptacle, Right Angle, SMT and Right Angle, Dual Stacked.

Part Number Description Number of Positions / Contacts Termination Style
78495-0001 Micro SAS Receptacle, Right Angle, Dual Stacked 50 Through Hole
78395-0001 Micro SAS Receptacle, Right Angle, SMT 25 SMD/SMT

Molex Micro SAS Receptacles





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Additional Resources:

Datasheet

Power, Signal, I/O
Molex eLearning: Overview of technology and Molex's three categories of connectors.

Network Solutions Cube 2.0
Molex eLearning: Select anywhere on the Cube to view the range of interconnect solutions for boards, modules, and cables.


Features and Benefits
  • Small connector footprint
  • Satisfies SAS 2.0 specifications
  • Intermateable with Micro Serial ATA parts
    with mid-rib in the connector housing
  • Application of Micro SAS Plug in 1.8"
    form factor drives (SSD or HDD)
    • Host receptacle on backplane accommodates Molex Micro SAS or Micro SATA drives
    • Drive can be built with any Molex Micro SAS or Micro SATA Plugs, and programmable with SAS or SATA firmware
  • Crush-ribs on plugs & dual-shaped pegs on receptacles provide added PCB retention to straddle-mounted plugs and seating of vertical receptacle on PCB, respectively
  • Keying features and guide rails on connectors prevent mis-mating and ensure smooth entry of plugs to receptacles


El
ectrical Specifications
  • Voltage (max.): 30V
  • Current (max.): 1.5 Amps DC or AC (RMS) at 60 Hz
  • Low Level Contact Resistance (min.): 45 milliohms (initial)
  • Dielectric Withstanding Voltage: 500V AC
  • Insulation Resistance (min.): 1000 Megaohms

Physical
Specifications
  • Housing: LCP, Glass-filled,UL 94V-0, Black
  • Contact: Copper Alloy
  • Plating:
    • Contact Area – 0.76μm (30μ") Gold (Au)
    • Solder Tail Area — 2.54μm (100μ") Tin (Sn) (78394)
      1.91μm (75μ") Tin (Sn) (78528)
    • Underplating — 1.27μm (50μ") Nickel
  • PCB Thickness: 1.00mm (.039")
  • Operating Temperature: 0 to +55°C


Mechanical
Specifications
  • Connector Insertion Force (max.): 20 N (to Backplane Receptacles)
  • Connector Removal Force (min.): 2.5N (to Backplane Receptacles)
  • Terminal Retention Force (min.): 4.45N
  • Durability (min.): 500 cycles (Backplane/Blindmate)

Markets and Applications
  • Storage Drives
    • Solid State Drives (SSD)
    • 1.8” HDD
  • Server Storage
    • RAID (Redundant Array of Individual Disks)
    • JBOD (“Just a bunch of disks”)
  • Adapters
    • HBA (Host Bus Adapters)












  • Molex
  • Connectors|Connector-I/O