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Home » NEWEST Products » New by Manufacturer » Molex » Molex LGA 2011-0 Server CPU Socket
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Molex LGA 2011-0 Server CPU Socket

Molex LGA 2011-0 Server CPU Socket

Molex LGA 2011-0 Server CPU Socket provides the electrical, mechanical and thermal reliability that enterprise servers, workstations and high-end PCs need to reach target performance levels of Intel’s Core i7 series of 32nm-Sandy Bridge-E microprocessors. The LGA 2011-0 socket features a fully loaded Interstitial Seating Plane (ISP) design for improved contact reliability by preventing circuit opens and shorts caused by contact deformation during a package overload. The socket uses high strength copper alloy contacts for robust performance. The socket terminals are oriented at angles that reduce the risk of cross-contact during processor overloads (‘over compression’). Compared with the LGA 1366 socket, the increase in the LGA 2011-0’s contact density of 12% while maintaining the 1.016mm via-pitch requirement would mean greater space-savings since a corresponding square pitch array requires a 0.9652mm via-pitch for the same package size.

Features
  • Satisfies requirements of “Intel Core i7 Processor Family for LGA2011-0 Socket Thermal / Mechanical Specification & Design Guide"
  • Supports 130W TDP and target performance requirements of Intel’s Core i7-3930K, Core i7-3820 and Core i7-3960K Extreme Edition processors
  • Fully loaded Interstitial Seating Plane (ISP) socket
  • Square or narrow Independent Loading Mechanism (ILM) Assembly options with varying ILM outline dimensions
  • Dual actuation-levers [U-shaped hinge lever and V-shaped (CPU) load lever with load cam] ensure planarity of seated processor for reliable electrical contact
  • Triangle-pin-1 identification on housing, load plate, alignment walls and orientation posts for true positioning and snug fit of the CPU on socket before loading
Electrical Specifications
  • Current (max.): 0.5A
  • Voltage (max): 5.0V
  • Contact Resistance (EOL): 22 milliohms max. socket average
  • Dielectric Withstanding Voltage: 360V (RMS)
  • Insulation Resistance: 800 Megaohms min.

Mechanical Specifications

  • Contact Insertion Force:  Zero Insertion Force (ZIF)
  • Durability (min.): 30 cycles

Applications

  • Data Applications (Servers, Workstations)
  • Other Markets (High-end PCs)
 Molex LGA Additional Product Features
  • Molex
  • Connectors|IC & Component Sockets