|    Change Country Change Location USD
United States United States

Please confirm your currency selection:

US Dollars
Home » NEWEST Products » New by Manufacturer » Molex » Molex 78588 Ultra-Low-Profile DDR3 DIMM Socket
NEWEST Products
Molex 78588 Series Ultra-Low-Profile DDR3 DIMM Socket

Molex 78588 Ultra-Low-Profile DDR3 DIMM Sockets

Molex 78588 Series Ultra-Low-Profile DDR3 DIMM Socket features a low seating plane of only 1.10mm – the lowest known in the industry. This new low-profile design from Molex also features a reduced latch actuation angle of 54% compared to standard DDR3 DIMM Sockets, providing more room for surrounding components. The Molex 78588 Series utilizes low-level contact resistance which supports the use of registered DIMM (RDIMM) modules and reduces power consumption in blade servers.

NEW! Molex expanded the 78588 Series to include an 30 micron gold-plated version that delivers greater vertical space and power savings for ATCA blade systems and other networking devices using high-density memory modules.


Ultra-low seating plane of 1.10mm height

Frees up vertical module space to allow use of high-density DIMMs while maintaining the same design height

Enables the use of very low-profile modules with seating heights below 2.80mm (maximum) in ATCA blade systems

Low-level contact resistance of 10 milliohms (maximum initial) 

Supports the use of Registered DIMM (RDIMM) modules and reduces power consumption in blade servers

Reduced latch-actuation angle 

Creates more room for neighboring components while improving airflow space around memory module socket

High-temperature, glass-filled socket housing and latches 

Provides robust module retention and ejection; able to withstand wave solder and IR reflow temperatures

Compliance with industry-standard specifications

Accepts JEDEC MO-269 memory modules 

Electrical Specifications
  • Voltage (max.): 29 Volts AC (RMS) / DC
  • Voltage Key Positions: Center. 1.5V
  • Current (max.): 1.0 Amps per pin
  • Low Level Contact Resistance (max.): 10 milliohms (initial)
  • Dielectric Withstanding Voltage: 500 VAC
  • Insulation Resistance (min.): 1 megaohm
Mechanical Specifications
  • Module Insertion Force D(with latches): 10.8 kgf (106N) max.
  • Terminal Retention Force (min.): Contact: 0.25kgf (2.5N)
  • Fork lock: 1.36kgf (13.3N)
  • Latch Actuation Force (to open): 4.5kgf (10lbs) max. per latch
  • PCB Retention Force: 0.45kgf (4.4N)
  • Durability: 25 cycles
  • Data/Network/Telecom
       – Desktop PCs
       – Servers
       – Workstations
       – Routers
       – Switches
       – Storage systems
       – Base stations
       – Server farms
       – Voice gateways
  • Industrial
      – Programmable logic systems
  • Medical
       – Advanced imaging devices

  • Molex
  • Connectors|Connector-Memory Card