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Ultra-low seating plane of 1.10mm height
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Frees up vertical module space to allow use of high-density DIMMs while maintaining the same design height
Enables the use of very low-profile modules with seating heights below 2.80mm (maximum) in ATCA blade systems
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Low-level contact resistance of 10 milliohms (maximum initial)
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Supports the use of Registered DIMM (RDIMM) modules and reduces power consumption in blade servers
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Reduced latch-actuation angle
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Creates more room for neighboring components while improving airflow space around memory module socket
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High-temperature, glass-filled socket housing and latches
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Provides robust module retention and ejection; able to withstand wave solder and IR reflow temperatures
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Compliance with industry-standard specifications
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Accepts JEDEC MO-269 memory modules
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