|    Change Country Change Location USD
United States United States

Please confirm your currency selection:

US Dollars
Home » NEWEST Products » New by Manufacturer » Molex » Molex 1.45mm micro-SIM Card Socket
NEWEST Products
Molex Logo

Molex 1.45mm micro-SIM Card Socket

Molex 1.45mm micro-SIM Card Socket without detect switch offers maximum PCB and vertical space-savings with anti-short and polarized card-insertion features for ultra-slim handheld devices. The 1.45mm micro-Sim Card Socket features a shell design that restricts lateral movements of the SIM card when inserted, even if improperly cut. Card polarization prevents the SIM card from being inserted in the wrong direction, and the reverse terminal design with gradual lead-in enables smooth card insertion and withdrawal. The round contact terminals provide excellent electrical contact.

  • Compact card socket with small footprint and low profile height offers optimum PCB real estate and vertical space savings
  • Shell design confines any lateral movements of the SIM card when inserted, even if improperly cut.
  • Reversed terminal-beam design with gradual lead-in prevents contact stubbing during card insertion and ensures easy card withdrawal as well
  • Built-in anti-shorting feature eliminates any risk of shorting between metal shield and contact pads of micro-SIM cards
  • Soldering features on metal shell and additional dummy solder tabs provide robust PCB hold-down applicable of socket

  • Mobile phones
  • Ultra-slim smart phones
  • Tablet PCs
  • GSM/UMTS modems
  • PC cards

    Electrical Specifications
    • Voltage (max.): 15V DC
    • Current (max.): 0.5A per contact
    • Low Level Contact Resistance (max.): 50 milliohm
    • Dielectric Withstanding Voltage: 500 VAC
    • Insulation Resistance (min.): 1000 megaohms

    Mechanical Specifications
    • Contact Normal Force: 0.20N at min. deflection
    • Card Withdrawal Force (min.): 0.5N
    • Durability (max.): 1500 cycles at 100 milliohms
    • Operating Temperature: -30°C to +85°C

    Physical Specifications
    • Housing: LCP (glass-filled), UL94V-0, Black
    • Contact: Copper Alloy
    • Plating:
      • Contact Area: 0.38μm (15μ") Gold (Au)
      • Solder Tail: 1.27μm (50μ") Matte Tin (Sn)
      • Underplating : 1.27μm (50μ") Nickel (Ni)
    • Shell Solder Tab: 1.27μm (50μ") Matte Tin (Sn) over 1.27μm (50μ") Nickel (Ni) underplate
      Anti-short feature
      Soldering Points
      Reverse Terminal Design

      • Molex
      • Connectors|Connector-Memory Card