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Home » NEWEST Products » New by Manufacturer » Molex » Molex zCD Interconnect System - Coming Soon
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Molex zCD™ Interconnect System

Molex zCD™ Interconnect System

Molex zCD™ Interconnect System supports next-generation 400 Gbps Ethernet applications by transmitting 400 Gbps data rates (25 Gbps per-serial-lane) with excellent signal integrity (SI), electro magnetic interference (EMI) protection, and thermal cooling.

Molex zCD connectors offer the densest, fastest interconnect on the market. These connectors are offered in two styles: style 1 (short body) for passive or active copper cables and style 2 (long body) for optics, such as active optical cables (AOCs) or pluggable transceivers. The zCD connectors feature a straight, back-route footprint with a 0.75mm pitch. An elastomeric gasket provides EMI containment and suppression. Designed to accept a broad range of thermal modules and heat sinks, the press-fit connector design ensures a robust and simple board termination.

Molex zCD passive copper cable assemblies offer the densest 25 Gbps copper solution on the market when used with the zCD style 1 connector. The small and highly flexible assembly will use proven individual twinax and braid construction for short-reach 400 Gbps Ethernet (GbE) or legacy and proprietary applications.

Molex zCD AOCs deliver 16-by-28 Gbps, or 400 Gbps of bandwidth, in a compact CDFP MSA standard interface. The zCD AOC design is based on singlemode silicon photonics technology and will transmit up to 4km for a fraction of the cost and power of long-reach optical modules. Primarily designed for 400 Gbps Ethernet applications, zCD AOCs will function with InfiniBand™ and proprietary protocol applications.


Connector Features
  • Data rates scalable up to 400 Gbps (25 Gbps over 16 lanes)
    • Supports high-bandwidth (fat pipe) next-generation applications
    • Enables 4.4 TBps with 11 modules on a line card. Supports next-generation 400 GbE
  • Designed to accept a broad range of customer-specified thermal modules and heat sinks
    • Provides excellent thermal management
  • Two versions
    • Style 1 (short body): accepts passive and active copper cables
    • Style 2 (long body): accepts active optical cables (AOCs)

Passive Copper Cable Assembly Features
  • Next-generation cable construction design
    • Delivers superior signal-integrity performance supporting data rates over 25 Gbps
  • 32 pairs (16 channels) per input/output (I/O) port at 25 Gbps
    • Provides the most bandwidth-dense solution available at 400 Gbps throughput per I/O port
  • Dual paddle-card system
    • Improves cross-talk performance through the cable interface.
    • Enhances manufacturing process for consistent construction
Active Optical Cable (AOC) Features
  • 16 bi-directional channels operating at up to 28 Gbps
    • Provides 400 Gbps data-transfer rate. Compatible with multiple protocols
  • Single-mode fiber technology
    • Delivers reaches in excess of 4km, enabling deployment in data center and campus environments
  • Silicon photonics technology
    • Offers a high level of integration. Enables excellent performance and long-term reliability

Applications
  • Telecommunications/Networking
    • Core switches
    • Data centers
    • Routers
  • Enterprise Computing
    • Top of Rack (TOR) Switches

Typical Product Configuration

Typical Product Configuration

  • Molex