Molex zCD™ Interconnect System
Molex zCD™ Interconnect System supports next-generation 400 Gbps Ethernet applications by transmitting 400 Gbps data rates (25 Gbps per-serial-lane) with excellent signal integrity (SI), electro magnetic interference (EMI) protection, and thermal cooling.
Molex zCD connectors offer the densest, fastest interconnect on the market. These connectors are offered in two styles: style 1 (short body) for passive or active copper cables and style 2 (long body) for optics, such as active optical cables (AOCs) or pluggable transceivers. The zCD connectors feature a straight, back-route footprint with a 0.75mm pitch. An elastomeric gasket provides EMI containment and suppression. Designed to accept a broad range of thermal modules and heat sinks, the press-fit connector design ensures a robust and simple board termination.
Molex zCD passive copper cable assemblies offer the densest 25 Gbps copper solution on the market when used with the zCD style 1 connector. The small and highly flexible assembly will use proven individual twinax and braid construction for short-reach 400 Gbps Ethernet (GbE) or legacy and proprietary applications.
Molex zCD AOCs deliver 16-by-28 Gbps, or 400 Gbps of bandwidth, in a compact CDFP MSA standard interface. The zCD AOC design is based on singlemode silicon photonics technology and will transmit up to 4km for a fraction of the cost and power of long-reach optical modules. Primarily designed for 400 Gbps Ethernet applications, zCD AOCs will function with InfiniBand™ and proprietary protocol applications.