Molex C-Grid Connector System
C-Grid
Molex C-Grid® Connector System is a dual row, wire-to-board system. The system includes: vertical and right angle headers in breakaway, shrouded and dual-body styles; vertical and right angle receptacles; headers and receptacles for SMT applications; press-fit headers and a 2-circuit shunt completes the C-Grid product line. The C-Grid® Connector System has the ability to mate with SL and KK® products. The Molex C-Grid® Connector System is suitable for low power signal applications such as computers, medical instruments, and automotive controls.
Features and Benefits
|
2.54mm pitch C-Grid® products combine
|
Largest number of variations and cabling configurations in the industry
|
|
FFC and IDT assemblies pre-assembled
|
Ease of use
|
|
Press-fit compliant-pin, low-profile, latching vertical- and right-angle headers
|
Design flexibility
|
Applications
- Automotive
- Audio, navigation, infotainment
- Car LCD panel
- Consumer
- Microwave oven, washing machine, white goods, etc.
- Data/Communications
- Desktop computer and motherboard
-
Medical
- ECG or EEG machines
- Respirators
- Networking
- 1U rack box
- Blade and rack-mount server
- Router/Switch
- Storage rack
|
| |
|
C-Grid III™
Molex C-Grid III™ is a 3rd generation 2.54mm (.100") pitch post and receptacle interconnection system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. C-Grid III is a highly-versatile 2.54mm interconnection system offering unique design features.
C-Grid III™ meets the latest industry requirements. Three different
termination techniques, solder tail, crimp, and insulation displacement,
are combined in a complete interconnection system which is based on
north/south contact orientation. Headers will accept both discrete wire
and ribbon cable connectors. The Box contact design employs the same mating concept with all
termination techniques. A uniform locking system on all contacts allows
full interchangeability inside different housing styles. C-Grid III is fully compatible with the industry standard DIN41651 as well as the French norm HE-13/14.
Features and Benefits
|
Surface Treatment
|
Available in 3 standard platings. Two performance levels of selective Gold and one of Tin, all over a Nickel-plated substrate, guarantee the optimum ration of quality versus cost of application.
|
|
Flexibility
|
Meets the latest industry requirements. Three different termination techniques, solder tail, crimp, and insulation displacement, are combined in a complete interconnection system which is based on north/south contact orientation. Headers will accept both discrete wire and ribbon cable connectors.
|
|
Advantage by Design
|
Box contact design employs the same mating concept with all termination techniques. A uniform locking system on all contacts allows full interchangeability inside different housing styles.
|
| Interchangeability |
Fully compatible with the industry standard DIN41651 as well as the French norm HE-13/14. Also, it is fully intermateable/interchangeable with Molex's QF-50 product range.
|
| Lower Applied Cost |
Incorporates a wide range of advanced application tooling, from manually-operated hand tools to semi-automatic harness making machines. C-Grid III offers the widest range of interconnection packaging alternatives in the electric market today.
|
Applications
- Commercial Vehicles
- Air bag sensors
- Sound systems
- Steering controls
- Consumer
- Copiers
- Fax machines
- Printers
|
|
|
