Littelfuse SPA Overview
|
SPA™ Lead-Free / Green Series
Designers of today's electronic devices have demanded more functionality with greater flexibility and higher levels of user interaction. These circumstances have helped in driving the development of nanometer chipsets along with a multitude of user interfaces or ports. The confluence of these two has made electronic devices more susceptible to ESD and required the need for a more robust solution.
ESD Standards:
MIL-STD-883, Method 3015
Historically, analog and digital designers have been required to have ESD protection "on-chip" to protect the IC during manufacturing. The most commonly used ESD standard in the manufacturing environment is the MIL-STD-883, Method 3015 and it's also referred to as the Human Body Model (HBM). This model discharges a 100pF capacitor through a 1500Ω resistor into the device under test. The table below points out the four test levels as defined
in the standard.
|
HBM Level
|
Contact Discharge (kV)
|
Peak Current (A)
|
|
1
|
±0.5
|
0.33
|
|
2
|
±1
|
0.67
|
|
3
|
±2
|
1.33
|
|
4
|
±4
|
2.67
|
The maximum level required for a typical IC had been ±2kV up until 2007, but today that level has been drastically reduced to ±0.5kV.Obviously, this has helped chip designers save valuable silicon area for more functionality, but in turn, it has made the IC much more susceptible to damage from ESD.
|
IEC61000-4-2
Conversely, equipment manufacturers have traditionally used an ESD standard defined by the IEC (International Electrotechnical Commission) for system or application level testing. This model uses a 150pF capacitor which is discharged through a 330Ω resistor. The table below displays the four test levels as defined in the standard.
IEC Level
|
Contact Discharge (kV)
|
Peak Current (A)
|
|
1
|
±2
|
7.5
|
|
2
|
±4
|
15
|
|
3
|
±6
|
22.5
|
|
4
|
±8
|
30
|
Most all manufacturers require that their equipment pass Level 4, or ±8kV, as a minimum, however, some are looking for increased reliability and require that their devices pass a much higher level like ±15kV or ±30kV.
Conclusions:
The system level ESD test defined by the IEC produces a substantial increase in peak current compared to the military standard. If an IC is rated for 0.5kVper the MIL-STD and the equipment manufacturer tests this same IC at8kV per the IEC specification, the chip will see nearly a 100 fold increase in peak current (i.e. 0.33A vs. 30A)!
Ultimately, hardware or board designers must add supplementary ESD devices to protect these sensitive chip sets from the high level ESD threats seen in the field.
|
Solutions:
Littelfuse's TVS Diode Arrays SPA™ are an ideal choice for suppressing ESD as their speed and clamping levels are essential to protect today's integrated circuits unlike the previous MLV, MOV, and polymer technologies. The SPA™ portfolio offers a wide range of devices to suit the majority of application needs available in the market today, and this guide will steer the designer toward the appropriate ESD device for the particular application they're trying to protect.
Additional Resource
Littelfuse Silicon Protection Arrays
|
General Purpose ESD Protection
Application Design Guide
Orderable
Part Number
|
Package
|
Number of Channels
|
ESD Level
(Contact)
|
I/O Capacitance
@ 2.5V
|
VRWM
|
Lightning
(tP
=8/20μs)
|
Datasheet
|
Typical Applications
|
| 576-SD05-01FTG |
SOD-323 |
1
|
±30kV |
- |
5.5V |
30A |
 |
DC Power Port, Keypad/ Push button, Switches |
| 576-SD05C-01FTG |
SOD-323
|
1 |
±30kV |
- |
5V |
30A |
 |
Keypad / Push button, Switches, uProcessor Input |
| 576-SP0502BAHTG |
SOT23-3 |
2
|
±20kV
|
30pF |
5.5V |
N/A
|

|
USB1.1, Keypad / Push button, Switches
|
| 576-SP0502BAJTG |
SC70-3 |
2 |
±20kV |
30pF |
5.5V
|
N/A
|
 |
| 576-SP0503BAHTG |
SOT-143 |
3 |
±30kV |
30pF |
5.5V |
N/A
|
 |
| 576-SP0504BAHTG |
SOT23-5 |
4 |
±20kV |
30pF |
5.5V
|
N/A
|
 |
| 576-SP0504BAJTG |
SC70-5 |
4
|
±20kV |
30pF |
5.5V
|
N/A
|
 |
| 576-SP0505BAHTG |
SC70-6 |
5
|
±20kV |
30pF |
5.5V
|
N/A
|
 |
| 576-SP0505BAJTG |
SC70-6 |
5 |
±30kV |
30pF |
5.5V
|
N/A
|
 |
| 576-SP0506BAATG |
MSOP-8 |
6
|
±20kV |
30pF |
5.5V
|
N/A
|
 |
|
576-SP1001-02JTG
|
SC70-3
|
2
|
±8kV
|
8pF
|
5.5V
|
2A
|
 |
USB1.1, Keypad / Push button, Switches,
CAN Bus, RS-485
|
|
576-SP1001-02XTG
|
SOT553
|
2 |
±8kV |
8pF
|
5.5V |
2A
|
 |
|
576-SP1001-04JTG
|
SC70-5
|
4
|
±8kV |
8pF |
5.5V |
2A
|
 |
|
576-SP1001-04XTG
|
SOT553
|
4 |
±8kV |
8pF |
5.5V |
2A
|
 |
|
576-SP1001-05JTG
|
SC70-6
|
5
|
±8kV |
8pF |
5.5V |
2A
|
 |
|
576-SP1001-05XTG
|
SOT563
|
5 |
±8kV |
8pF |
5.5V |
2A
|
 |
| 576-SP1002-01JTG |
SC70-3
|
1
|
±8kV |
5pF |
6V |
2A
|
 |
Audio (Speaker / Microphone), Analog Video |
| 576-SP1002-02JTG |
SC70-5 |
2 |
±8kV |
5pF |
6V |
2A
|
 |
| 576-SP1003-01DTG |
SOD723 |
1
|
±30kV |
30pF |
5V |
7A
|
 |
DC Power Port, Keypad / Push button, Switches
|
NEW!
576-SP1003-01ETG
|
SOD-882 |
1 |
±30kV |
30pF |
5V |
7A
|

|
| 576-SP1004-04VTG |
SOT953 |
4
|
±8kV |
5pF |
6V |
2A |
 |
Audio (Speaker / Microphone), Analog Video |
NEW!
576-SP1005-01ETG |
SOD-882 |
1 |
±30kV |
30pF |
6V |
10A
|
 |
DC Power Port, Keypad / Push button, Switches, Audio (Speaker / Microphone), Analog Video |
NEW!
576-SP1005-01WTG
|
0201 FlipChip |
1 |
±30kV |
30pF |
6V |
10A |
 |
NEW!
576-SP1007-01ETG |
SOD-882 |
1 |
±8kV |
3.5pF
|
6V |
2A |
 |
USB1.1, USB2.0, FM Antenna, Audio (Speaker / Microphone), Analog Video
|
| 576-SP1007-01WTG |
0201 FlipChip |
1 |
±8kV |
5pF |
6V |
2A
|
 |
NEW!
|
0201 Flipchip
|
1 |
±15kV
|
;6pF
|
6V |
2.5A |
 |
|
576-SP1011-04UTG
|
μDFN-6
|
4
|
±15kV
|
7pF
|
6V
|
2A
|
 |
USB1.1, Keypad / Push button, Switches, SIM Socket |
| 576-SP720ABTG |
SOIC-16 |
14 |
±4kV |
3pF |
2-30V |
3A |
 |
uProcessor Input, RS-232, Switches, USB1.1
|
| 576-SP720APP |
PDIP-16 |
14 |
±4kV |
3pF |
2-30V |
3A |
 |
| 576-SP720ABG |
SOIC-16 |
14 |
±4kV |
3pF |
2-30V |
3A |
 |
| 576-SP721APP |
PDIP-8 |
6 |
±4kV |
3pF |
2-30V |
3A |
 |
| 576-SP721ABG |
SOIC-8 |
6
|
±4kV |
3pF |
2-30V |
3A |
 |
| 576-SP721ABTG |
SOIC-8 |
6
|
±4kV |
3pF |
2-30V |
3A |
 |
576-SP723ABG
|
SOIC-8 |
6 |
±8kV |
5pF |
2-30V |
7A |
 |
| 576-SP723ABTG |
SOIC-8 |
6
|
±8kV |
5pF |
2-30V |
7A |
 |
| 576-SP723APP |
PDIP-8 |
6 |
±8kV |
5pF |
2-30V |
7A |
 |
| 576-SP724AHTG |
SOT-23-6 |
4 |
±8kV |
3pF |
1-20V |
3A |
 |
| 576-SP725ABTG |
SOIC-8 |
4 |
±8kV |
5pF |
2-30V
|
7A |
 |
SP050x
The surface mount family of arrays are designed to suppress
ESD and other transient overvoltage events. The Littelfuse
SP050x
arrays are used to meet the International Electrotechnical
Commision Standard (IEC 61000-4-2) for Electrostatic Discharge
Requirements. The series are used to help protect sensitive digital or
analog input circuits on data, signal, or control lines with voltage
levels up to 5VDC.
The monolithic silicon arrays are comprised of specially
designed structures for transient voltage suppression (TVS). The size
and shape of these structures have been tailored for transient
protection. The low capacitance and clamp voltage are ideal for high
speed signal line protection.
SP1001,
SP1006
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of protection
for electronic equipment that may experience destructive electrostatic
discharges (ESD). Littelfuse's
SP1001 and
SP1006
robust diodes can safely absorb repetitive ESD strikes at
the maximum level specified in the IEC 61000-4-2 international standard
(Level 4, ±8KV contact discharge) without performance degradation. Their
very low loading capacitance also makes them ideal for protecting high
speed signal pins.
SP1003
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of protection
for electronic equipment that may experience destructive electrostatic
discharges (ESD). These Littelfuse
SP1003
robust diodes can safely absorb repetitive ESD strikes at
±25kV (contact discharge, IEC 61000-4-2) without performance
degradation. Additionally, each diode can safely dissipate 7A of 8/20µs
surge current (IEC61000-4-5) with very low clamping voltages.
SP1005
SP1005
SPA® Diodes are the newest additions to the SPA™ portfolio
and provide best-in-class ESD protection by offering the lowest dynamic
resistance in the industry's smallest available footprint.
SP1005
SPA® Diodes (30pF @ 0V) offer up to ±30kV
ESD protection and 10A (tp=8/20µs) of surge protection with only 0.7Ω of
dynamic resistance, providing best-in-class clamping performance.
Additional Resources
USB1.1 Application Guide
Audio (Speaker/Microphone)Application Guide
Keypad/Push Buttons Application Guide
Low Capacitance ESD Protection
Application Design Guide
Orderable
Part Number |
Package |
Number of
Channels |
ESD Level
(Contact) |
I/O Capacitance |
VRWM |
Lightning
(t P =8/20μs) |
Datasheet |
Typical Applications |
NEW!
576-SP0504SHTG |
SOT23-6 |
4 |
±12kV |
0.85pF |
6V |
4.5A |
 |
USB 2.0, eSATA, 1394a/b, DVI, SIM Socket, 10/100/1000 Ethernet (PHY Side) |
NEW!
576-SP0524PUTG |
μDFN-10
|
4 |
±8kV |
0.5pF |
5V |
4A |
 |
eSATA, HDMI 1/3/1.4, USB 3.0, DisplayPort, 10/100/1000 Ethernet (PHY Side) |
| 576-SP3001-04JTG |
SC70-6 |
4 |
±8kV |
0.65pF |
6V |
2.5A |
 |
USB 2.0, eSATA, 1394a/b, DVI, SIM Socket, 10/100/1000 Ethernet (PHY Side)
|
| 576-SP3002-04HTG |
SOT23-6 |
4 |
±12kV |
0.85pF |
6V |
4.5A |
 |
| 576-SP3003-02JTG |
SC70-5 |
2
|
±8kV |
0.65pF |
6V |
2.5A |
 |
| 576-SP3003-02XTG |
SOT553 |
2 |
±8kV |
0.65pF |
6V |
2.5A |
 |
| 576-SP3003-02UTG |
µDFN-6L |
2 |
±8kV |
0.65pF |
6V |
2.5A |
 |
| 576-SP3003-04JTG |
SC70-6 |
4 |
±8kV |
0.65pF |
6V |
2.5A |
 |
| 576-SP3003-04XTG |
SOT563 |
4
|
±8kV |
0.65pF |
6V |
2.5A |
 |
| 576-SP3003-04ATG |
MSOP-10 |
4 |
±8kV |
0.65pF |
6V |
2.5A |
 |
USB 2.0, eSATA, 1394a/b, DVI, SIM Socket, 10/100/1000 Ethernet (PHY Side) |
NEW!
576-SP3003-08ATG |
MSOP-10 |
8
|
±8kV |
0.65pF |
6V |
2.5A |
 |
eSATA, HDMI 1/3/1.4, USB 3.0, DisplayPort, 10/100/1000 Ethernet (PHY Side) |
| 576-SP3010-04UTG |
μDFN-10
|
4
|
±8kV |
0.45pF |
6V |
3A |
 |
| 576-SP3011-06UTG |
μDFN-14
|
6 |
±8kV |
0.4pF |
5V |
3A |
 |
USB 3.0, HDMI 1.3/1.4 |
| 576-SP3012-04UTG |
μDFN-10
|
4 |
±12kV |
0.5pF |
5V |
4A |
 |
eSATA, HDMI 1/3/1.4, USB 3.0, DisplayPort, 10/100/1000 Ethernet (PHY Side) |
NEW!
576-SP3012-06UTG
Learn More |
μDFN-14
|
6 |
±12kV |
0.5pF |
5V |
4A |
 |
USB 3.0, HDMI 1.3/1.4 |
| 576-SP3021-01ETG |
SOD-882
|
1 |
±8kV |
0.5pF |
5V |
2A |
 |
USB 3.0, HDMI 1.3/1.4, MoCA |
| 576-SP3031-01ETG |
SOD-882
|
1 |
±10kV |
0.8pF |
5V |
5A |
 |
USB 2.0, eSATA, 1394a/b, DVI, 10/100/1000 Ethernet (PHY Side) |
The
Littelfuse
SP30xx
Series has
ultra-low
capacitance
rail-to-rail
diodes
with an additional
zener diode
fabricated in a proprietary silicon avalanche technology to protect electronic equipment that may experience destructive
electrostatic discharges
(ESD). The low loading capacitance makes it ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.
SP0504S - NEW!
The Littelfuse SP0504S Series has ultra low capacitance rail-to-rail diodes with an additional zener diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.
SP0524P - NEW!
The Littelfuse SP0524P Series integrates 4 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394.
SP3012 - NEW!
The
Littelfuse
SP3012
Series integrates either 4 or 6 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal lines such as USB3.0, HDMI, USB2.0, and eSATA.
SP3021
The Littelfuse
SP3021
includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present.
SP3031
The Littelfuse
SP3031
includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines.
Lightning Surge Protection
Application Design Guide
Orderable
Part Number
|
Package
|
Number of
Channels
|
ESD Level
(Contact)
|
I/O Capacitance
|
VRWM
|
Lightning
(tP
=8/20μs)
|
Datasheet
|
Typical
Applications
|
| 576-SP3050-04HTG
|
SOT23-6
|
4
|
±20kV
|
2.4pF
|
6V
|
10A
|
 |
10/100/1000 Ethernet (PHY Side), T1/E1/T3/E3 |
|
|
SOIC-8
|
2
|
±30kV
|
16pF
|
3.3V
|
150A
|
 |
10/100/1000 Ethernet (Line Side), CAN Bus, RS-485
|
NEW!
|
SOIC-8
|
2
|
±30kV
|
12pF
|
3.3V
|
150A
|
 |
| 576-LC03-3.3BTG |
SOIC-8
|
2
|
±30kV
|
12pF
|
3.3V |
150A
|
 |
|
576-SP03-6BTG
|
SOIC-8
|
2
|
±30kV
|
16pF
|
6V
|
150A
|
 |
NEW!
576-SP2502LBTG |
SOIC-8 |
2 |
±30kV |
5pF |
3.3V
|
75A |
 |
10/100/1000 Ethernet (Line Side), 10/100/1000 Ethernet (PHY Side) |
NEW!
576-SP2504NUTG |
μDFN-10
|
4 |
±30kV |
3.5pF |
2.5V |
20A
|
 |
10/100/1000 Ethernet (PHY Side), T1/E1/T3/E3
|
NEW!
576-SP3304NUTG |
μDFN-10
|
4 |
±30kV
|
3.5pF |
3.3V |
20A
|
 |
NEW!
|
SOIC-8
|
2
|
±30kV
|
5pF
|
3.3V
|
75A
|
 |
10/100/1000 Ethernet (PHY Side) |
|
576-SP4060-08ATG
|
MSOP-10
|
8
|
±30kV
|
4.4pF
|
2.5V
|
20A
|
 |
LVDS, 1000 Ethernet (PHY Side) |
NEW!
|
μDFN-10
|
4
|
±30kV
|
3.5pF
|
2.5V
|
20A
|
 |
10/100/1000 Ethernet (PHY Side), T1/E1/T3/E3
|
NEW!
|
μDFN-10
|
4
|
±30kV
|
3.5pF
|
3.3V
|
20A
|
 |
| 576-SPLV2.8-4BTG |
SOIC-8
|
4 |
±30kV
|
3.8pF
|
2.8V
|
24A
|
 |
576-SLVU2.8-4BTG
|
SOIC-8
|
4
|
±30kV
|
3.8pF
|
2.8V
|
24A
|
 |
| 576-SPLV2.8HTG |
SOT-23-3 |
1 |
±30kV
|
2pF |
2.8V |
40A
|
 |
576-SLVU2.8HTG
|
SOT-23-3 |
1 |
±30kV
|
2pF |
2.8V |
40A
|
 |
| 576-SR05-02CTG |
SOT-143 |
2 |
±30kV |
6pF |
5V |
25A |
 |
10/100 Ethernet (PHY Side), T1/E1/T3/E3 |
| 576-SRV05-4HTG |
SOT23-6 |
4
|
±20kV |
2.4pF |
6V |
10A |
 |
10/100/1000 Ethernet (PHY Side), T1/E1/T3/E3 |
SRV05(SP3050)
The
Littelfuse
SRV05
(SP3050) Series integrates low capacitance rail-to-rail
diodes
with an additional
zener diode
to protect each I/O pin against
ESD
and
high surge
events. This robust device can safely absorb surge current per IEC 61000-4-5 (t
P
=8/20μs) without performance degradation and a minimum ±20kV ESD per IEC 61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins.
LC03-3.3
(SP03-3.3)
This new broadband protection device from
Littelfuse
provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. The new
LC03-3.3 (SP03-3.3)
protectors combine the TVS
diode
element with a
diode
rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution.
SP2502L
-
NEW!
The Littelfuse SP2502L Series provides overvoltage protection for applications such as 10/100/1000 Base-T Ethernet and T3/E3 interfaces. This device has a low capacitance of only 5pF making it suitable for PHY side Ethernet protection and the capability to protect against both longitudinal and differential transients. Furthermore, the SP2502L is rated up to 100A (tp=2/10μs) making it suitable for line side protection as well against lightning transients as defined by GR-1089 (intra-building), ITU, YD/T, etc.
SP2504N
-
NEW!
The Littelfuse SP2504N Series integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD. This robust device can safely absorb up to 20A per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard. The low loading capacitance makes the SP2504N ideal for protecting high-speed signal pins.
SP3304N
-
NEW!
The Littelfuse SP3304N Series integrates 4 channels of low capacitance diodes with an additional zener diode to protect sensitive I/O pins against lightning induced surge events and ESD. This robust device can safely absorb up to 20A per IEC61000-4-5 (tP=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 international standard.
|