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Home » NEWEST Products » New by Manufacturer » Hirose Electric » Hirose IT3 Connectors : Mouser.com
NEWEST Products
Hirose High Speed Board to Board Connectors
Hirose High Speed (10Gbps) Board to Board Connectors
BGA Mezzanine Connectors, IT3 Series

The Hirose IT3 Series High-Speed BGA Mezz Connectors are Hirose's newest offering in the High-Speed mezzanine field . The connectors have the ability to transmit differential, single-ended, and power through one package. The stackable IT3 Series (from 15 to 40mm) provides reliable connections for today's data rates of PCIe and XAUI, as well as the emerging 10+Gbps systems. The Hirose IT3 Series High-Speed BGA Mezz Connectors feature a unique 3-piece structure for flexibility, a staggered 1.5mm x 1.75mm ball grid array; 100, 200, and 300 contacts (+90% additional grounds); differential, single-ended, and power; low mating/extracting forces; wide misalignment tolerances for multiple connector use; and excellent reflow solderability.

The IT3 system is composed of three, basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB and different height interposer assemblies are selected to achieve the needed height between the PCB's.

Learn more about Hirose's entire line of High-Speed Board to Board Connectors:
FX10, FX11, IT3, FX18
Hirose IT3 Series High-Speed BGA Mezz Connectors
IT3 Receptacle
IT3 Interposer
Part Number Contact Positions Type Solder Ball
Material
Length (mm)
IT3D-100S-BGA(37) 100 (100 signals/
90 grounds)
Mating Pb-free (SAC305) 21
IT3D-100S-BGA(57) 100 (100 signals/
90 grounds)
Mating SnPb 21
IT3M-100S-BGA(37) 100 (100 signals/
90 grounds)
Mounting Pb-free (SAC305)
21
IT3M-100S-BGA(57) 100 (100 signals/
90 grounds)
Mounting SnPb 21
IT3D2-180S-BGA(57) 180 (180 signals/
162 grounds)
Mating SnPb
38.5
IT3M2-180S-BGA(57) 180 (180 signals/
162 grounds)
Mounting SnPb 38.5
IT3D-200S-BGA(37) 200 (200 signals/
180 grounds)
Mating Pb-free (SAC305)
38.5
IT3D-200S-BGA(57) 200 (200 signals/
180 grounds)
Mating SnPb 38.5
IT3M-200S-BGA(37) 200 (200 signals/
180 grounds)
Mounting Pb-free (SAC305)
38.5
IT3M-200S-BGA(57) 200 (200 signals/
180 grounds)
Mounting SnPb 38.5
IT3D-300S-BGA(37) 300 (300 signals/
270 grounds)
Mating Pb-free (SAC305)
56
IT3D-300S-BGA(57) 300 (300 signals/
270 grounds)
Mating SnPb 56
IT3M-200S-BGA(37) 300 (300 signals/
270 grounds)
Mounting Pb-free (SAC305) 56
IT3M-200S-BGA(57) 300 (300 signals/
270 grounds)
Mounting SnPb 56
IT3M-300S-BGA(37) 300 (300 signals/
270 grounds)
Mounting
Pb-free (SAC305) 56
IT3M-300S-BGA(57)
300 (300 signals/
270 grounds)
Mounting
SnPb 56

Part Number Height (mm)
IT3-200P-17H(03) 17
IT3-300P-17H(03) 17
IT3-100P-20H(03) 20
IT3-200P-20H(03) 20
IT3-300P-20H(03) 20
IT3-200P-22H(03) 22
IT3-300P-22H(03) 22
IT3-100P-25H(03) 25
IT3M2-180P-25H(03) 25
IT3-200P-25H(03) 25
IT3-300P-25H(03) 25
IT3-100P-26H(03) 26
IT3-200P-26H(03) 26
IT3-300P-26H(03) 26
IT3-100P-28H(03) 28
IT3M2-180P-28H(03) 28
IT3-200P-28H(03) 28
IT3-300P-28H(03) 28
IT3-200P-30H(03) 30
IT3-300P-30H(03) 30
IT3-200P-32H(03) 32
IT3-300P-32H(03) 32
IT3-300P-40H(03)40
IT3-300P-40H(03) 40


High Density and Unmatched Reliability
Hirose IT3 Assembly
Hirose IT3 Series High-Speed BGA Mezz Connectors High Density and Unmatched Reliability


IT3 's unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pairs per linear inch.





Excellent SI Performance

The high performance Hirose IT3 was designed through exhaustive and detailed simulation. Data from measurement correlations support current applications needing 6.25+ Gbps, and future applications of 20+ Gbps.



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