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Home » NEWEST Products » New by Manufacturer » Hirose Electric » Hirose High Speed Board to Board Connectors
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Hirose High Speed Board to Board Connectors

Hirose High Speed Board to Board Connectors


Hirose High Speed Board to Board Connectors Overview

Hirose Electric Co., Ltd., a specialist in the design and manufacture of the latest electronic connectors, produces a variety of High Speed Board to Board Connectors for mezzanine applications, coplanar or vertical, with optional ground plates, and a wide range of positions and stacking heights.

Hirose High Speed Board to Board Connectors
Product Matrix
Product Family Connector Description No. of Positions Current Rating(Amps)(Max.) Stack Height (mm) Contact Mating Area Plating Terminal Pitch (mm)
IT3 Mezzanine Connector
100, 200, 300 0.5A
17, 20, 22, 25, 26, 28, 30, 32, 38, 40 Gold BGA
FX10 Two-piece connector with ground 80, 96, 100, 120, 140, 144, 168 0.3 4, 5 Gold 0.5
FX11 Two-piece connector with ground 60, 68, 80, 92, 100, 116, 120, 140 0.3 2, 2.5, 3 Gold 0.5
FX18 Coplaner and Vertical two piece connector with ground 40, 60, 80, 100, 120, 140 0.5 2 (Mating length) Gold 0.8

Hirose IT3 Series High-Speed BGA Mezz Connectors

Hirose IT3 Series High-Speed BGA Mezz ConnectorsThe IT3 Series connector system is Hirose's newest offering for applications in the high-speed, mezzanine field. The Hirose IT3 can handle today's data rates of PCI-X and XAUI and tomorrow's 10+ Gbps requirements. Its has the versitility to transmit differential, single ended and power in one package. Stacking heights are available fron 15-40mm.

The IT3 system is composed of three, basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB and different height interposer assemblies are selected to achieve the needed height between the PCB's.

 

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High Density and Unmatched Reliability
Hirose IT3 Series High-Speed BGA Mezz Connectors High Density and Unmatched Reliability

IT3's unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pairs per linear inch.


Excellent SI Performance

The high performance IT3 was designed through exhustive and detailed simulation. Data from measurement correlations support current applications needing 6.25+ Gbps, and future applications of 20+ Gbps.

Click image to enlarge


Hirose FX10 Series B2B Connectors

Hirose FX10 Series B2B ConnectorsThe Hirose FX10 Series B2B Connectors are 0.5mm pitch headers and receptacles with optional ground plates on both sides of the header and receptacle to improve transmission characteristics. Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. With a stacking height of either 4mm or 5mm, the FX10 series provides additional solder weld strength through metal fittings. Hirose's FX10 Series B2B Connectors without the grounding plate have been filled with additional signal contacts. In addition, Hirose offers the 10+ Gbps 0.5mm Pitch B2B Connectors as an electrical interface for the OIF 100G Long-Haul DWDM Transmission Module (MSA-100GLH). The FX10 Series B2B Connectors feature a rated current of 0.3A and a rated voltage of 50VAC. Ideal for notebook computers, PDA, and other miniature electronic equipment.

Hirose FX10 Mechanical Features
  • 0.5mm Pitch
  • Stacking Height : 4 ~ 8mm
  • Number of Contacts
    • With ground plate type : 80 / 100 / 120 / 140
    • Without ground plate type : 96 / 120 / 144 / 168
  • Improved Transmission Efficiency Between Boards
    • Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle.
  • 10 Signal:1 Ground Arrangement
    • Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise.
  • Metal Fittings for Added Solder Weld Strength
    • Metal fittings provide greater adhesion to the board, protecting against peeling. The unique connector design provides a connection between the fitting and the ground plate for a stronger ground.
  • Suited to High-Density Applications
    • The signal contact pitch of 0.5 mm produces a smaller connector utilizing less board area for mounting.
  • High contact reliability
    • Effective mating length is 1.1 mm for signal contacts.
  • Optional Ground Plate
    • An alternate style without the ground plate is available. The space provided by the ground plate removal has been filled with additional signal contacts.
Hirose FX10 10+ Gbps Signal Integrity Features
  • Insertion Loss-to-Crosstalk-Ratio (ICR)
    • The insertion loss-to-crosstalk ratio (ICR) with five-aggressor differential FEXT meets the extrapolated IEEE802.3ap specification for 10+Gbps.
  • Differential Impedance
    • The differential impedance is within 100±10 ohms at 35 ps rise time( 20% to 80%)
Hirose FX10 Series ICR
Hirose FX10 Diagrams

Click image to enlarge



Hirose FX11 Series B2B Connectors
Hirose FX11 Series B2B Connectors

The Hirose FX11 Series B2B Connectors are 0.5mm pitch headers and receptacles with optional ground plates on both sides of the header and receptacle to improve transmission characteristics. Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. The FX11 is structured to prevent solder wicking via a solder gap in the contact SMT portion. With a stacking height of either 2mm, 2.5mm, or 3mm, the FX11 series comes in 60, 80, 100, or 120 contact positions, provides additional solder weld strength through metal fittings. Hirose's FX11 Series B2B Connectors without the grounding plate have been filled with additional signal contacts (in the 2mm height - 68, 92, 116, and 140 contact positions). These board-to-board connectors feature a rated current of 0.3A and a rated voltage of 50VAC. Ideal for notebook computers, PDA, and other miniature electronic equipment.

Hirose FX11 Series B2B Connector Features
Hirose FX11 Series Advantage
  • The transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle.
  • Signal and ground are arranged in a ratio of 10:1 to stabilize the ground.
  • Reinforced fittings that make a firm connection to the ground also provide greater adhesion to the board, protecting against peeling.
  • Low-profile connectors, yet a solder gap has been designed into the contact SMT portion to prevent solder from migrating.
  • The secured mating length of the contact block is 0.55mm for the 2mm B to B type, and 1mm for the 2.5 or 3mm B to B type to ensure high contact reliability.

Click to enlarge

Hirose FX11 Series B2B Connector Applications
  • Notebook PCs
  • Portable terminals (PDA)
  • Portable electronic equipment
Characteristic Specifications
No. of Positions 60, 68, 80, 92, 100, 116, 120, 140
Current Rating(Amps)(Max.) 0.3
PCB Mount Type SMT
Contact Mating Area Plating Gold
Terminal Pitch (mm) 0.5
Contact Spacing (mm) 0.5
Stack Height (mm) 2, 2.5, 3
Operating Temperature Range (degrees C) -55 to 85
Connector Type Board mounting
Contact Gender Female, Male
Hirose FX18 Series B2B Connectors

Hirose Electric FX18 Series Hi-Speed B2B ConnectorsThe Hirose Electric FX18 Series Hi-Speed B2B Connectors are headers and receptacles, right angle or straight, with a 0.8mm pitch for coplanar or vertical connection. The FX18 features high-speed transmission capability up to 10Gbps and multi-functional (MF) contact (ground contact, power supply contacts up to 12A, and 3-step sequential contacts). With a large mating guide for smooth insertion, the Hirose Electric FX18 Series Hi-Speed B2B Connectors mate with a signal contact of 2.0mm and offer a voltage rating of AC100V. Contacts and MF contacts are phosphor bronze with gold-plated contact area and mounting area and nickel-plated under plating.

Hirose FX18 Series B2B Connectors Mechanical Features
  • 0.8mm Pitch
  • Variations :Coplanar / Vertical
  • Number of Contacts : 40 / 60 / 80 / 100 / 120 / 140
  • Multi functional contact (MF contact) as;
    • ground contact to enhance grounding.
    • power supply contacts up to 12 A to reduce required pin counts.
    • 3-step sequential contacts for grounding and detection.
  • Effective mating length of signal contact: 2.0 mm.
    • (MF contact A:2.5mm / MF contact B:1.5mm)
  • Pin through hole mounting MF contacts increase strength against wrenching.
  • Large mating guide for easy mating.
Hirose FX18 Series B2B Connectors Signal Integrity Features
  • Insertion Loss-to-Crosstalk-Ratio (ICR)
    • The insertion loss-to-crosstalk ratio (ICR) with five-aggressor differential FEXT meets the extrapolated IEEE802.3ap specification for 10+Gbps with plenty of margins.
  • Differential Impedance
    • The differential impedance is within 100±10 ohms at 35 ps rise time( 20% to 80%)


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