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Home » NEWEST Products » New by Manufacturer » FCI » FCI MezzoStak™ Connectors
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FCI MezzoStak™ Connectors

FCI MezzoStak™ 0.5mm Pitch Board-to-Board Mezzanine Connectors feature a hermaphroditic "mates-to-self" design using the same part number for both mated sides, reducing inventory and administration costs. MezzoStak connectors ensure highly reliable performance with guidance "scoops" to permit easy mating when mis-aligned, polarization to prevent mis-mating, dual-point mating for redundant electrical contact, and high retention force to ensure a secure connection. FCI MezzoStak 0.5mm Pitch Board-to-Board Mezzanine Connectors are suited for portable & mobile electronics, medical & instrumentation, hand-held terminals, automatic identification & data capture, sensors, military, communications & networking, motor vehicle, and metering & energy applications.

Features
  • Hermaphroditic "mates to itself" design reduces inventory and administration costs
  • Easy, reliable Mating
    • Guidance "scoops" permit easy mating when mis-aligned
    • Polarization prevents mis-mating
    • Dual-point, long wipe contacts
  • High un-mating force ensures connection security
  • Precise 0.08mm maximum SMT lead co-planarity eases attachment of connector leads to PCBs
  • Footprint compatible with major competitors
  • High Speeds, including PCIe®G2 , supported by signal integrity reports and S-parameter models
  • 0.5mm high density contact pitch in two rows
    • 7 Stack heights: 4mm to 7mm (0.5mm increments)
    • 6 Sizes: 20 to 70 positions (10 position increments)
Applications
  • Portable and mobile electronic equipment
  • Medical and Instrumentation
  • Point-of-Sale/Retail equipment
  • Hand-held terminals
  • Automatic Identification and Data Capture
  • Sensors
  • Military
  • Communications and Networking
  • Data and mass-storage
  • Motor Vehicle
  • Metering and Energy
Electrical Specifications
  • Current rating per contact: 0.50 amps (de-rated)
  • DWV: 500 volts
  • Voltage Rating: 50 volts
  • Contact resistance: 30 milliohm max.
  • Signal Integrity
    (Differential pairs; 7mm stack height; Connectors with SMT pads and anti-pads/voids underneath)
    • 5+ Gbs capable
    • Impedance: 100 Ohms +/- 10% @ 50 ps edge
    • Insertion Loss: < 1 dB to 5+ GHz
    • NEXT and FEXT: </= 1.0% @ 50 ps edge (10-90%)
Mechanical Specifications
  • Durability: 50 mating cycles in environment
  • Mating Force: 42g max per contact pair
  • Un-mating force: 25g min per contact pair
  • Wipe length: 1.0 mm min.
  • SMT lead co-planarity: 0.08mm max.
  • Operating Temperature: -40ºC and 125ºC
  • Processing Temperature: 260ºC peak for 30 second

FCI MezzoStak Mating
FCI MezzoStak Mating


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