TE Connectivity micro SFP+ Connector and Cable Assembly increase faceplate density while freeing up additional PCB space due to the board connector's shortened length. TE Connectivity micro SFP+ interconnects feature a footprint that is up to 50% smaller than SFP+, taking up as little as 15mm board space. The cable assembly and connector provide a staggered contact configuration that improves signal routing. The bottom and top contacts are further optimized for speed. These micro SFP+ interconnects are designed for telecommunications, data communication, medical diagnostic equipment, and networking applications.