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Home » NEWEST Products » New by Manufacturer » Bergquist Company » Bergquist Gap Pad® VO Ultra Soft Gap Filling Material
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The Bergquist Company

Berguist Gap Pad® VO Ultra Soft Gap Filling Material

Gap Pad® VO Ultra Soft from Bergquist is ultra conformable gel-like Gap Filling Material with thermal conductivity of 1.0 W/m-K. For applications requiring a minimum amount of pressure on components, the material gives excellent low-stress vibration dampening and shock absorbency. Bergquist Gap Pad® VO Ultra Soft Gap Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.

  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • "Gel-like" modulus
  • Designed for low-stress applications
  • Puncture, shear and tear resistant
  • Electrically isolating
  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • Between heat-generating semiconductors or magnetic components and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • Bergquist Company
  • Thermal Management