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Home » NEWEST Products » New by Manufacturer » Bergquist Company » Bergquist Gap Pad® 3000S30 Gap Filling Material
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The Bergquist Company

Bergquist Gap Pad® 3000S30 Gap Filling Material

Bergquist Gap Pad® 3000S30 is a fiberglass-reinforced, soft "S-Class" Gap Filling Material. It features thermal conductivity of 3.0W/m-K which, offering exceptional thermal performance at low pressures. The material is supplied with protective liners on both sides which have naturally inherent tack. Gap Pad® 3000S30 Gap Filling Material from Bergquist is ideal for high-performance, low-stress applications that would typically use fixed standoff or clip mounting. The conformable, yet elastic material offers excellent interfacing and wet-out characteristics.

  • Thermal conductivity: 3.0 W/m-K
  • Low "S-Class" thermal resistance at very low pressures
  • Highly conformable,"S-Class" softness
  • Designed for low-stress applications
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Processors
  • Server S-RAMs
  • Mass storage drives
  • Wireline / wireless communications hardware
  • Notebook computers
  • BGA packages
  • Power conversion
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  • Thermal Management