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Home » NEWEST Products » New by Manufacturer » Bergquist Company » Bergquist Gap Pad® 2500S20 Gap Filling Material
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The Bergquist Company

Bergquist Gap Pad® 2500S20 Gap Filling Material

Gap Pad® 2500S20 from Bergquist a highly conformable, reinforced Gap Filling Material rated at 2.4W/m-K for thermal conductivity. It features low "S-Class" thermal resistance at ultra-low pressures for applications that typically use fixed standoff or clip mounting. The material is reinforced with fiberglass to resist puncture, shear, and tear. With protective liners provided over the inherent natural tack on both sides, Bergquist's Gap Pad® 2500S20 Gap Filling Material allows for stick-in-place characteristics during application assembly.

Features
  • Thermal conductivity: 2.4 W/m-K
  • Low "S-Class" thermal resistance at ultra-low pressures
  • Ultra conformable,"gel-like" modulus
  • Designed for low-stress applications
  • Fiberglass reinforced for puncture, shear and tear resistance
Applications
  • Between processors and heat sinks
  • Between graphics chips and heat sinks
  • DVD and CDROM electronics cooling
  • Areas where heat needs to be transferred to a frame, chassis or other type of heat spreader
  • Bergquist Company
  • Thermal Management