Ampro by ADLINK LittleBoard™ 735
Extreme Rugged™ Intel® Atom™ EBX Single Board Computer
Ampro by ADLINK LittleBoard™ 735 Extreme Rugged™ Intel® Atom™ EBX Single Board Computer (SBC) is based on the Intel® Atom™ CPU and 945GSE chipset, and provides a feature-rich, mid-performance SBC for a wide range of legacy-friendly applications. The LittleBoard™ 735 is ideal for migrating legacy EBX systems to the latest lowest-power Atom™ platform. Featuring a PC/104-Plus expansion interface for legacy PC/104 and PC/104-Plus modules, this SBC is well-rounded with dual Ethernet, CRT and flat panel video, 4 serial ports, 6 USB ports, SATA and IDE interfaces, CompactFlash socket, PCIe Mini Card socket, High Definition Audio, and GPIO support for an easy upgrade from older EBX SBCs.
Features
- Legacy migration solution
- Dual Gigabit Ethernet
- 4 COM, 6 USB, audio
- SATA, IDE, Compact Flash
- PCIe Mini Card socket
- PC/104-Plus expansion
- Full-featured Atom™ platform
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Ampro by ADLINK is part of the Intel® Intelligence Systems Alliance, one of the world's most recognized and trusted technology ecosystems. Members of the Intel® Intelligent Systems Alliance include leading solution and service providers from a broad range of industries, who provide the hardware, software, firmware, tools, and systems integration that developers need to take a leading role in the rise of intelligent systems.
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Intel® Atom™ Processor N270
The Intel® Atom™ Processor N270 (code named Mobile Diamondville) is built on 45nm process technology — the first generation of low-power IA-32 microarchitecture specially designed for Netbook’08 Platform. In this platform, the processor supports Intel®945GSE chipset with the I/O Controller Hub - Intel 82801GBM.
Features
- New single-core processor for mobile devices
- On-die primary 32kB instructions cache and 24kB write-back data cache
- 533MHz source-synchronous front side bus (FSB)
- 2-Threads support
- On-die 512kB, 8-way L2 cache
- Support for IA 32-bit architecture
- Intel® Streaming SIMD Extensions-2 and -3 (Intel® SSE2 and Intel® SSE3)
support and Supplemental Streaming SIMD Extension 3 (SSSE3) support
- Micro-FCBGA8 packaging technologies
- Thermal management support via Intel® Thermal Monitor 1 and
Intel Thermal Monitor 2
- FSB Lane Reversal for flexible routing
- Supports C0/C1(e)/C2(e)/C4(e)
- L2 Dynamic Cache Sizing
- Advanced power management features including Enhanced Intel
SpeedStep® Technology
- Execute Disable Bit support for enhanced security
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