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TI DualCool™ NexFET™ Power MOSFETs

Texas Instruments DualCool™ NexFET™ Power MOSFETs

The Texas Instruments DualCool ™ NexFET ™ Power MOSFET delivers an industry standard footprint while enabling thermally efficient cooling through the top and bottom of the package. The unique package of the TI DualCool NexFET Power MOSFET allows power system designers to effectively direct heat away from the PCB in high-current DC/DC applications, resulting in improved power density, high-current capability, and improved system reliability. The TI DualCool MOSFET offers 80% higher power dissipation along with 50% more current in standard footprint. DualCool NexFET Power MOSFET s are optimized for control FET applications and Point-of-Load synchronous buck in networking, telecom, and computing systems. DualCool MOSFET s are part of the TI NexFET MOSFET family. The TI NexFET family also includes the high-performance TI NexFET Power Block.


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Features
  • Enables top-side cooling
  • 80% higher power dissipation
  • 50% more current in standard footprint

Applications
  • Point-of-Load Synchronous Buck in Networking, Telecom, and Computing Systems
  • Optimized for Synchronous FET Applications

DualCool NexFET Power Dissipation Comparison

Texas Instruments DualCool NexFET Thermal Comparison

Part Number
Datasheet
Size (mm)
VDS (V)
VGS (V)
R at 10V (mΩ)
R at 4.5V (mΩ)
Qg (nc)
Qgd (nc)
CSD16325Q5C

5x6
25
10
__ 1.7
18
2.9
CSD16322Q5C
5x6
25
10
__ 4.5
6.5
1.2
CSD16321Q5C
5x6
25
10
__ 2.1
14
2.5
CSD16407Q5C
5x6
25
16
1.8
2.5
13.3
3.5
CSD16408Q5C
5x6
25
16
3.7
5.4
6.5
1.9


  • Texas Instruments
  • Industrial|Power Management
  • Semiconductors|Transistors (FETs, Bipolars & IGBTs)