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Home » NEWEST Products » New by Manufacturer » Texas Instruments » Texas Instruments Smart Metering Solution
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TI Winning Solution

Texas Instruments Smart Metering Solution



Texas Instruments Smart Metering Solution

Check out this three-phase energy metering solution from Texas Instruments that delivers the high linearity required for accurate power measurement and the isolation necessary to meet industry standards regulating power and communications for e-metering. This TI Winning Solution is composed of:

ADS131E08 - Analog front-end for power monitoring and control
AMC1100 - 4.25kVPEAK isolated amplifier
ISO7241C - Quad channel, 25Mbps digital isolator
TMS320F2812 - 32-bit digital signal controller with Flash

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Key Solution Features
  • Highly-integrated, multi-channel, multi-bit, analog front end
    • Reduces board space, design time and complexity in design of analog signal path
  • Precision isolation amplifier
    • Provides a highly effective barrier to magnetic interference without distorting input signal
  • Multi-channel digital isolation
    • High voltage protection and ground isolation with data rates accommodating emerging e-metering protocols
  • 32-bit real-time MCU with onboard memory
    • Processes system data and runs communication protocol

A Smart Metering Solution
A Smart Metering Solution
Texas Instruments ADS131E04 / ADS131E06 / ADS131E08 Analog Front-End for Power Monitoring

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TI ADS131E08 Analog Front-End device for Power Monitoring, Control, and Protection is part of a family of multichannel, simultaneous sampling, 24- and 16-bit, delta-sigma (ΔΣ) analog-to-digital converters (ADCs) with a built-in programmable gain amplifier (PGA), internal reference, and an onboard oscillator. TI ADS131E0x AFE devices incorporate features commonly required in industrial power monitoring, control, and protection applications. The ADS131E0x inputs can be independently and directly interfaced with a resistor-divider network or a transformer to measure voltage. The inputs can also be interfaced to a current transformer or Rogowski coil to measure current. With high integration levels and exceptional performance, the ADS131E0x family enables the creation of scalable industrial power systems at significantly reduced size, power, and low overall cost. The ADS131E0x AFE devices have a flexible input multiplexer per channel that can be independently connected to the internally-generated signals for test, temperature, and fault detection. These TI ADCs can operate at data rates as high as 64kSPS.

Features
  • Eight Differential Current and Voltage Inputs
  • Outstanding Performance:
    • Exceeds Class 0.1 Performance
    • Dynamic Range at 1kSPS: 118dB
    • Crosstalk: -110dB
    • THD: -90dB at 50Hz and 60Hz
  • Supply Range:
    • Analog:
      • +3 V to +5 V (Unipolar)
      • ±2.5V (Bipolar, allows dc coupling)
    • Digital:
      • +1.8V to +3.6VLow Power: 2mW per Channel
  • Data Rates: 1, 2, 4, 8, 16, 32, and 64kSPS
  • Programmable Gains (1, 2, 4, 8, and 12)
  • Fault Detection and Device Testing Capability
  • SPI™ Data Interface and Four GPIOs
  • Operating Temperature Range: -40°C to +105°C
Applications
  • Industrial Power:
    • Energy Metering
    • Monitoring, Control, and Protection
Part Number Resolution (bits) Input Channels Power Consumption (Typ) (mW)
ADS131E04 24 4 8
ADS131E06 24 6 12
ADS131E08 24 8 16

Functional Block Diagram

Functional Block Diagram
Texas Instruments AMC1100 Fully-Differential Isolation Amplifier

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TI AMC1100 Fully-Differential Isolation Amplifier is a precision isolation amplifier with an output separated from the input circuitry by a silicon dioxide (SiO2) barrier that is highly resistant to magnetic interference. This barrier has been certified to provide galvanic isolation of up to 4250 VPEAK, according to UL1577 and IEC60747-5-2. TI AMC1100 can be used in conjunction with isolated power supplies to prevent noise currents on a high common-mode voltage line from entering the local ground and interfering with or damaging sensitive circuitry. The input of this isolation amplifier is optimized for direct connection to shunt resistors or other low voltage level signal sources. The excellent performance of the device enables accurate current and voltage measurement in energy-metering applications.

Features
  • ±250mV Input Voltage Range Optimized for Shunt Resistors
  • Very Low Nonlinearity: 0.075% max at 5V
  • Low Offset Error: 1.5mV max
  • Low Noise: 3.1 mVRMS typ
  • Low High-Side Supply Current:
  • 8mA max at 5V
  • Input Bandwidth: 60kHz min
  • Fixed Gain: 8 (0.5% Accuracy)
  • High Common-Mode Rejection Ratio: 108dB
  • Low-Side Operation: 3.3V
  • Certified Galvanic Isolation:
    • UL1577 and IEC60747-5-2 Approved
    • Isolation Voltage: 4250 VPEAK
    • Working Voltage: 1200 VPEAK
    • Transient Immunity: 2.5kV/µs min
  • Fully Specified Over the Extended Industrial Temperature Range
Applications
  • Shunt Resistor Based Current Sensing in:
  • Energy Meters
  • Green Energy
  • Power Measurement Applications

Typical Application Diagram
Typical Application Diagram
Texas Instruments ISO7241C Quad Channel, 3/1, 25Mbps, Digital Isolator

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Additional Resources

TI ISO7241C Quad Channel, 3/1, 25Mbps, Digital Isolator is part of a digital isolator family that features multiple channel configurations and output enable functions. This TI device has logic input and output buffers separated by TI's silicon dioxide (SiO2) isolation barrier. Used in conjunction with isolated power supplies, these devices block high voltage, isolate grounds, and prevent noise currents from entering the local ground and interfering with or damaging sensitive circuitry. ISO7241 has three channels the same direction and one channel in opposition. The C option devices have TTL input thresholds and a noise-filter at the input that prevents transient pulses from being passed to the output of the device. The M option devices have CMOS Vcc/2 input thresholds and do not have the input noise-filter or the additional propagation delay.

Features
  • Selectable Failsafe Output
  • 25 and 150Mbps Signaling Rate Options
    • Low Channel-to-Channel Output Skew; 1ns Max
    • Low Pulse-Width Distortion (PWD); 2ns Max
    • Low Jitter Content; 1ns Typ at 150Mbps
  • Typical 25-Year Life at Rated Working Voltage
  • 4000Vpeak VIOTM, 560Vpeak, VIORM per IEC 60747-5-2 (VDE 0884, Rev 2)
  • UL 1577, IEC 61010-1, IEC 60950-1 and CSA Approved
  • 4 kV ESD Protection
  • Operates With 2.8-V (ISO7241C), 3.3-V or 5-V Supplies
  • High Electromagnetic Immunity
  • -40°C to 125°C Operating Range
Applications
  • Industrial Fieldbus
  • Computer Peripheral Interface
  • Servo Control Interface
  • Data Acquisition

Functional Diagram
Functional Diagram
Texas Instruments TMS320F2812 32-Bit Digital Signal Controller

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Additional Resources

TI TMS320F2812 32-Bit Digital Signal Controller (DSC) with Flash features high-performance CMOS technology, a 32-bit CPU, and a low-power core. TMS320F2812 DSC contains 128K x 16 of embedded flash memory, segregated into four 8K x 16 sectors, and six 16K x 16 sectors. This TI device also contains a single 1K x 16 of OTP memory at address range 0x3D 7800-0x3D 7BFF. The user can individually erase, program, and validate a flash sector while leaving other sectors untouched.

Features
  • High-Performance Static CMOS Technology
    • 150 MHz (6.67ns Cycle Time)
    • Low-Power (1.8V Core at 135MHz, 1.9V Core at 150MHz, 3.3V I/O) Design
  • JTAG Boundary Scan Support IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture
  • High-Performance 32-Bit CPU (TMS320C28x)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • 4M Linear Program/Data Address Reach
    • Code-Efficient (in C/C++ and Assembly)
    • TMS320F24x/LF240x Processor Source Code Compatible
  • On-Chip Memory
    • Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors)
    • ROM Devices: Up to 128K x 16 ROM
    • 1K x 16 OTP ROM
    • L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM)
    • H0: 1 Block of 8K x 16 SARAM
    • M0 and M1: 2 Blocks of 1K x 16 Each SARAM
  • Boot ROM (4K x 16)
    • With Software Boot Modes
    • Standard Math Tables
  • External Interface (2812)
    • Over 1M x 16 Total Memory
    • Programmable Wait States
    • Programmable Read/Write Strobe Timing
    • Three Individual Chip Selects


Functional Diagram
Functional Diagram
  • Texas Instruments
  • Semiconductors|Integrated Circuits|IC-Power Management