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Home » NEWEST Products » New by Manufacturer » Texas Instruments » TI CC2560 Bluetooth Smart Ready Controller
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Texas Instruments CC2560 Bluetooth Smart Ready Controller

TI CC2560 Bluetooth Smart Ready Controller

Texas Instruments CC2560 Bluetooth Smart Ready Controller is a complete BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI's seventh-generation core, this device brings a product-proven solution that supports 4.0 dual mode (BR/EDR/LE) protocols. TI’s power-management hardware and software algorithms provide significant power savings in all commonly used BR/EDR/LE modes of operation. When coupled with an MCU device, this HCI device provides best-in-class RF performance for mobile phone accessories, sports and fitness applications, wireless audio solutions, remote controls, and toys.

With transmit power and receive sensitivity, TI CC2560 provides a best-in-class range of about 2x, compared to other BLE-only solutions. A royalty-free software stack available from TI is pre-integrated with TI's MSP430 and Stellaris MCUs.

Features
  • Single-chip Bluetooth Smart Ready solution integrating basic rate (BR)/enhanced data rate (EDR)/low energy (LE) features fully compliant with the Bluetooth 4.0 specification up to the HCI layer
  • BR/EDR features include:
    • Up to seven active devices
    • Scatternet: Up to 3 piconets simultaneously, 1 as master and 2 as slaves
    • Up to two SCO links on the same or different piconets
    • Support for all voice air-coding – continuously variable slope delta (CVSD), A-Law, µ-Law, and transparent (uncoded)
  • LE features include:
    • Supports up to 6 simultaneous connections
    • Multiple sniff instances that are tightly coupled to achieve minimum power consumption
    • Independent buffering for LE allows large numbers of multiple connections without affecting BR/EDR performance.
    • Includes built-in coexistence and prioritization handling for BR/EDR and LE
  • Flexibility for easy stack integration and validation into various microcontrollers, such as Stellaris and MSP430
  • Highly optimized for low-cost designs:
    • Single-ended 50Ω RF interface
    • Package footprint: 76 pins, 0.6-mm pitch, 8.10- × 7.83-mm mrQFN
  • Best-in-class (RF) performance (TX power, RX sensitivity, blocking)
    • Class 1.5&Prime.l TX power up to +12 dBm
    • Internal temperature detection and compensation to ensure minimal variation in RF performance over temperature, no external calibration required
    • Improved AFH algorithm with minimum adaptation time
    • Provides longer range, including 2x range over other BLE-only solutions
Applications
  • Mobile phone accessories
  • Sports and fitness applications
  • Wireless audio solutions
  • Remote controls
  • Toys

Functional Block Diagram

Functional Block Diagram

Transport Layers

Transport Layers
  • Texas Instruments