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TE Connectivity RTP Reflowable Thermal Protection Devices

Reflowable Thermal Protection Solutions for Power Electronics Designs in Rugged Environments

TE Connectivity Reflowable Thermal Protection (RTP) features low resistance, robust surface mountable thermal protection devices with a set open temperature. The RTP devices are designed to withstand the demanding requirements of the automotive and industrial applications, including shock, vibration, temperature cycling, and humidity exposure. RTP devices can withstand temperatures up to 260⁰C during solder reflow without opening prior to the arming procedure. The newly patented, one-time electronic arming procedure allows the open temperature to be selected so that the device opens in thermal runaway event before reaching the melt temperature of typical lead free solders, but remains closed when the components are operating within the normal parameters. After arming, the RTP opens if its internal junction exceeds the device's specified temperature to protect downstream devices from thermal overload.

TE Connectivity has expanded their product line of Reflowable Thermal Protection Devices to include Low Temperature RTP Devices with an operating temperature range of 40ºC to +105ºC. The lower temperature range makes these devices well-suited for the suitable for consumer, datacom, and appliance markets.

  • Opens at temperature below critical thermal threshold to help prevent failed components from smoking and/or de-soldering in case of a thermal event
  • Uses standard surface-mount production methods with no special assembly costs
  • Compatible with up to 3 Pb-free solder reflow processes with peak temperatures up to 260°C
  • Low series resistance, power dissipation, and voltage drop
  • Robust design for rugged environment applications (automotive, industrial, etc.)
  • Tested per stringent qualification specifications including AEC-Q101, AEC-Q200, and AEC-Q100
  • RoHS compliant, lead and halogen free

  • Automotive
    • HVAC
    • ABS
    • Power steering
  • DC/DC converters

  • PTC heaters

  • IT servers
  • Telecom power
  • Converters
TE Connectivity RTP Reflowable Thermal Protection Devices
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Additional Resources:


Mandarin Datasheet

Product Overview

Application Overview

Resistance and Open Characteristics P 1 to P TH
Min. Typical Max. Units
RPP (Resistance from P 1 to P TH ) @ 23+/-3°C - 0.6 0.8 mΩ
@ 175+/-3°C - 0.8 1.2
Operating Voltage - - 32 - V DC
Open Temperature, post-arming I PP = 0 196 205 213 °C
Thermal Resistance: Junction to Case Case = P TH pad - 0.5 - °C/W
Installation dependent Operating Current, post-arming (1&2) @ 23+/-3°C 32 34 - A
@ 100+/-3°C - 28 -
@ 175+/-3°C - 10 -
Moisture Sensitivity Level Rating (per JEDEC J-STD-020C) - - 1 - -

(1) Results obtained on 44.5 x 57.2 x 1.6 (in mm) single layer FR4 boards with 70μm (2oz) Cu traces,a 645mm2, 70μm (2oz) Cu heat spreader connected to the P TH pad, and a 387mm2 Cu heat spreader connected to the P 1 pad of the RTP device. Results are highly installation dependent.

(2) Operating current is measured on the RTP test boards at the specified temperature. It is a highly installation dependent value.

Additional YouTube Videos:

RTP Reflow Process

PCB Trace Protection

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  • TE Connectivity
  • Industrial|Transportation
  • Circuit Protection