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Home » NEWEST Products » New by Manufacturer » Intel » Silvermont 22nm Microarchitecture - Intel
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Intel Silvermont 22nm Microarchitecture

Intel Silvermont 22nm Microarchitecture

Overview

Intel's Silvermont 22nm Microarchitecture is designed in 22nm technology based on the next generation Intel Atom™ microarchitecture. Silvermont is a new low power SoC processor microarchitecture. The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products, and will be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency. The Silvermont microarchitecture delivers industry-leading performance-per-watt efficiency. The highly balanced design brings increased support for a wider dynamic range and seamlessly scales up and down in performance and power efficiency. On a variety of standard metrics, Silvermont also enables ~3x peak performance or the same performance at ~5x lower power over the current-generation Intel Atom processor core.


 

Bay Trail Platform Processors

Intel's Bay Trail Platform is most suitable for new embedded designs, refresh of designs based on previous Intel Atom processor-based platforms, designs targeting both commercial and extended temperature ambience/environments and designs requiring ECC based memory configurations. These processors offer enhanced visual experiences (media processin, stereoscopic 3D, and Video HD Technology), embedded specific enhancements, and true low power SoC (with leading integrated IOs, integrated memory controller, IO expansion capabilities, re-architected CPU cores, content security, and outstanding visuals & imaging).

    General Specifications
  • Cores: 1 to 4
  • Threads: 1 to 4
  • Clock Speed:1.33GHz to 2.0GHz
  • Cache: 512KB to 2MB
  • 22nm Lithography
  • 2.0W to 4.5W Max TDP
    Memory Specifications
  • Up to 8GB Max Memory Size (dependent on memory type)
  • Memory Types: DDR3L-1066, DR3L-1067, DDR3L-1333, DDR3L-RS 1333, and LPDDR3-1066
  • Memory Channels:1 or 2
  • ECC Memory Supported *
    Graphics Specifications
  • Intel HD Graphics
  • Intel Quick Sync Video *
  • Intel Insider *
  • Intel Clear Video HD Technology *
  • Intel Wireless Display *
    Expansion Options
  • PCI Express Revision 2.0 *
  • x1, x2, x4 PCI Express Configurations *
  • Max # of PCI Express Lanes: 4 *
    I/O Specifications
  • USB Revision: 2.0, 3.0 *
  • Total # of SATA Ports: 2 *
  • UART *
    Advanced Technologies
  • Intel Virtualization Technology (VT-x)
  • AES New Instructions
  • Intel 64
  • Idle States *
  • Enhanced Intel SpeedStep® Technology *
  • Intel Identity Protection Technology *
  • Intel HD Audio Technology *
    Intel Platform Protection Technology
  • Execute Disable Bit *
  • Anti-Theft Technology *
    Intel Data Protection Technology
  • AES New Instructions *
  • Secure Key *
    Package Specifications
  • TJUNCTION
    • 100ºC or 110ºC *
  • Package size:
    • 17.0mm x 17.0mm, 25.0mm x 27.0mm*
  • Low Halogen Options Available: See MDDS
* Refer to the posted datasheets for details on included specifications and technologies. 

Avoton Platform Processors

Intel's Avoton Platform features a range of multi-core pin-compatible system on chips (SoCs), extending the scalability of Intel architecture into smaller footprint and energy-efficient communications infrastructure systems. Based on the newest Silvermont microarchitecture, these SoCs utilize Intel’s industry-leading 22nm process technology with 3-D Tri-Gate transistors. Featuring an out-of-order execution engine, outstanding power management capabilities, and enhanced security, this microarchitecture offers significant performance and power improvements over prior-generation Intel Atom processors. These SoCs offer a range of multi-core processing capabilities (from two cores up to eight cores), a thermal design power (TDP) range of 7W to 20W, and high levels of I/O and acceleration integration, resulting in a highly scalable single-chip solution. They are ideal for thermally constrained solutions such as entry to mid-range branch office routers, security appliances, wireless access, communications servers, control plane processors, and storage

    General Specifications
  • Cores: 2 to 8
  • Threads: 2 to 8
  • Clock Speed: 1.7GHz to 2.4GHz
  • 2.0GHz Max Turbo Frequency
  • Instruction Set: 64-bit
  • Lithography: 22nm
  • 7W to 20W Max TDP
    Memory Specifications
  • Up to 32GB Max Memory Size (dependent on memory type)
  • Memory Types: DDR3, 3L 1333, DDR3, 3L 1600
  • Memory Channels: 1 or 2
  • ECC Memory Supported
    Advanced Technologies
  • Intel Turbo Boost Technology (C2300 only)
  • Intel Virtualization Technology (VT-x)
  • AES New Instructions
  • Intel 64
  • Intel QuickAssist Technology
    I/O Specifications
  • USB Revision: 2.0
  • # of USB Ports: 4
  • Total # of SATA Ports: Up to 6
  • Integrated LAN: 4x1 or 4x2.5 (GbE)
  • UART: 2 Interfaces
  • Max # of SATA 6.0Gb/s Ports: 2
    Expansion Options
  • PCI Express Revision: 3.0
  • PCI Express Configurations: Up to 1x16, 2x8, 1x8/2x4
  • PCI Express Lanes: 16
    Package Specifications
  • 34mm x 28mm package size
  • Low Halogen Options Available: See MDDS
   
  • Intel