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Home » NEWEST Products » New by Manufacturer » Intel » i3-3217UE i3 Core Processors - Intel
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Intel i3-3217UE i3 Core Processors

Intel's 3rd Generation i3-3217UE i3 Core Processors are 64-bit, multi-core processors built on 22nm process technology. The processor is designed for a two-chip platform. The two-chip platform consists of a processor and a Platform Controller Hub (PCH) and enables higher performance, lower cost, easier validation, and improved x-y footprint. The processor includes Integrated Display Engine, Processor Graphics, and an Integrated Memory Controller. The processor is designed for mobile platforms. Intel's i3-3217UE Series provides a 1.8GHz clock speed, Max TDP of 17W, 16GB Max Memory, and a Intel HD Graphics 4000 processor.

Additional Resources

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Datasheet Specification Update

Computing Solutions
Part Number Data Sheet Manufacturer Name Processor Type Chipsets Form Factor
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General Specifications
  • 2 Cores
  • 4 Threads
  • 1.8GHz Clock Speed
  • 3MB Intel Smart Cache
  • 5 GT/s DMI
  • 64-bit Instruction Set
  • AVX Instruction Set Extensions
  • 22nm Lithography
  • 17W Max TDP
Advanced Technologies
  • Intel Hyper-Threading Technology
  • Intel Virtualization Technology (VT-x)
  • Intel 64
  • Intel Anti-Theft Technology
  • Intel My WiFi Technology
  • Idle States
  • Enhanced Intel SpeedStep® Technology
  • Thermal Monitoring Technologies
  • Intel Fast Memory Access
  • Intel Flex Memory Access
  • Execute Disable Bit
  • Intel VT-x with Extended Page Tables (EPT)
  • Intel Identity Protection Technology
Expansion Options
  • PCI Express Revision 2.0
  • 1x16, 2x8, 1x8 2x4 PCI Express Configurations
  • 1 PCI Express Lanes
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    Memory Specifications
    • 16GB Max Memory Size (dependent on memory type)
    • DDR3/L/-RS 1333/1600 Memory Types
    • 2 Memory Channels
    • 25.6GB/s Max Memory Bandwidth
    Graphics Specifications
    • Intel HD Graphics 4000 Processor Graphics
    • 350MHz Graphics Base Frequency
    • 1.05GHz Graphics Max Dynamic Frequency
    • eDP/DP/HDMI/SDVO/CRT Graphics Output
    • Intel Quick Sync Video
    • Intel InTru™ 3D Technology
    • Intel Insider™
    • Intel Wireless Display
    • Intel Flexible Display Interface (Intel FDI)
    • Intel Clear Video HD Technology
    • 3 Displays Supported
    Package Specifications
    • 1 Max CPU Configuration
    • 105°C TJUNCTION
    • 31mm x 24mm (BGA1023) package sizes
    • 22nm Graphics and IMC Lithography
    • FCBGA1023 Sockets Supported
    • Low Halogen Options Available: See MDDS

    • Intel
    • Embedded Solutions